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EP4S-80: One Part, Silver Filled Epoxy for EMI/RFI Shielding

Master Bond EP4S-80 is a one component, silver filled epoxy for bonding, sealing and coating. This NASA low outgassing approved system cures at the low temperature of 80˚C and bonds well to a variety of substrates. Watch this video to see how this low viscosity compound can be dispensed through a syringe or brushed on to create a protective coating. Learn more here  .

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    Transcript

    00:00:00 [Music] masterbond ep-4s-80 is a one component silver filled epoxy that cures at the low temperature of 80 degrees celsius this non-premixed and frozen system has an unlimited working life and features a low viscosity for advanced bonding sealing and gap filling applications its smooth flowable consistency and

    00:00:34 volume resistivity of 0.02 to 0.06 ohm centimeter makes it ideal for static dissipation in emi rfi shielding applications as well as for specialty encapsulations where electrical conductivity is desirable here it is seen being brushed on as a coating material showing ease of brushability ep4s-a has a simple cure schedule of 60 to 90

    00:01:01 minutes at 80 degrees celsius and offers wide temperature serviceability from -60 degrees celsius to 160 degrees celsius this system features both high compressive strength as well as a high tensile modulus and bonds well to metals ceramics composites and many plastics for more information or to discuss your application contact us today