Power Device Analyzer / Double-Pulse Tester
Keysight Technologies, Santa Rosa, CA, has announced the new PD1550A Advanced Dynamic Power Device Analyzer, a next-generation Double-Pulse Tester (DPT) with the enhanced capability to test entire power modules up to 1360 V and up to 1000 A. This enables customers to test entire power modules faster and easier than ever before.
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High-Voltage Power Inductors
Coilcraft, Cary, IL, is introducing their RFC0807BV Series power inductors — a high-voltage version of their RFC0807B Series. Their operating voltage is rated at 800 V and are a cost-effective solution for high-voltage, universal off-line (non-isolated) AC/DC power supplies in a variety of industrial and automotive applications.
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High-Voltage DC Switching Contactors
TDK, Tokyo, Japan, is introducing the B88269 HVC Series Gas-Filled High-Voltage Contactors. They are available in bipolar and unipolar designs with continuous current capacity up to 500A and nominal voltages up to 1200 V and are specially designed to disconnect DC circuits.
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Smart Transmitter with Bluetooth
Endress+Hauser, Greenwood, IN, has launched the iTEMP TMT142B, new generation smart temperature transmitter with Bluetooth. The transmitter delivers highly accurate and reliable measurements, wireless communication via Bluetooth, and user-friendly operation — all packaged in a robust single-chamber field housing. The Bluetooth interface enables users to wirelessly visualize measured values, NAMUR NE 017 diagnostic information, as well as to perform configuration tasks.
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New Rugged Computing Solution
Galleon Embedded Computing, Oslo, Norway, has introduced the XSR Half Rack Server. It has been designed specifically for deployed C5ISR applications where high performance and extreme ruggedness are essential requirements. With its compact 3U half-width 19” form factor and innovative cooling architecture, the XSR Half Rack Server offers state-of-the-art reliability while occupying a minimal installation footprint.
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Removable Edge Bonder
Panacol, Torrington, CT, has developed Structalit® 5705, a new, removable edge bonder specifically formulated for bonding consumer electronics components. In addition to reworkability, the main feature of the black adhesive is that it fluoresces yellow when excited by UV light. This significantly enhances the accuracy of in-line optical inspection systems.
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AI Accelerator Card
Lanner Electronics, New Taipei City, Taiwan, collaborated with AI chipmaker Hailo Engineering Intelligence, Tel Aviv, Israel, to design the Falcon H8, a cost-efficient PCIe AI accelerator card with low power consumption and record high of up to 156 tera operations per second (TOPS) to allow high-end deep learning applications on edge servers.
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Compression Software
The emCompress-PRO new all-in-one compression software from SEGGER Microcontroller GmbH, Monheim am Rein, Germany, comes with all industry-standard compression algorithms. It includes compression algorithms such as DEFLATE, LZMA, and LZJU90, providing full interoperability with third-party and open-source tools and libraries. It also comes with example code demonstrating how to access standard archive formats such as Zip.
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Agile Engineering Design System
Concepts NREC, White River Junction, VT, has announced the Agile Engineering Design System®, an integrated suite of Computer-Aided Engineering (CAE) and Computer-Aided Manufacturing (CAM) software products specialized for turbomachinery. The CAE release debuts the new Fidelity user interface, a single, intuitive UI that includes COMPAL, AXIAL, AxCent, and the newest addition to the product suite, CYCAL.
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3D-Modelling Software
Renishaw, Inc., West Dundee, IL, has announced the release of FixtureBuilder 8.0, the latest version of its 3D fixture modelling software. It allows users to design metrology fixturing set-ups without having to go near their coordinate measuring machines (CMM) and other inspection devices. This reduces the amount of unproductive set-up time and increases the productivity of inspection machines.
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3D Snapshot Sensor for Surface Inspection of Large Objects
The surfaceCONTROL 3D 2500 snapshot sensor from Micro-Epsilon, Raleigh, NC, is used in 3D measurements for geometry, shape, and surface inspection on diffuse reflecting surfaces. It is characterized by its large measuring field as well as a high measuring range depth of up to 300 mm with a repeatability of up to 3.0 μm.
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Interconnect Solutions for 5G/Gen-Z Networks and Systems
Carlisle Interconnect Technologies, St. Augustine, FL, is offering high-performing, low-cost cable assemblies, connectors, and interconnect systems for 5G and Gen-Z systems used in Internet of Things (IoT), network infrastructure, automotive and autonomous driving, medical services, military and defense, and aerospace applications. 5G networks require high bandwidths, faster data speeds, and ultra-low latency to successfully deliver next-generation performance.
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Eco-Friendly, Powder-Based Additive Material
Jabil, Inc., St. Petersburg, FL, has launched PK 5000, an eco-friendly, powder-based additive material engineered to deliver improved strength, chemical resistance, and resilience in comparison to general-purpose nylon materials, such as PA 12. This patent-pending material has been formulated to support highly demanding automotive, consumer electronics, defense, medical, and industrial manufacturing applications.
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Vacuum-Tight Connector
Lemo®, Ecublens, Switzerland, has introduced the M series HY connector, a new model specifically designed for all applications requiring vacuum-tight connections in harsh environments. Its ultra-low leak rate, coupled with the wide operating temperature range of -5° to +150° C, and high vibration resistance, allow for high performance in optical enclosures or high-altitude applications.
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