Epoxy for Large Potting and Encapsulation Applications
EP29LPAO is a two component thermally conductive, electrically insulative epoxy well suited for potting and encapsulating. This video explains proper handling and mixing techniques for this product as well as demonstrates various casting applications, highlighting its low exotherm and long working life. Click here for more information.
More From SAE Media Group
Tech Briefs
Product Spotlight: EP30NS
Tech Briefs
Product Spotlight: Supreme 18TC
Tech Briefs
Nanosilica Filled UV Curable Adhesive System
Tech Briefs
Low Temperature Curing, One Component Epoxy
Tech Briefs
UV-Curable Epoxy System
Tech Briefs
Breaking Through the Walls of Thermal Management
Automotive Engineering
High Temperature, Flexible Epoxy
Tech Briefs
Conductive Carbon Fiber Polymer Composite
Tech Briefs
New Coatings Reduce Impact Ice Adhesion Strength
Medical Design Briefs
EP79FL Electrically Conductive Epoxy
Tech Briefs
AERoBOND: Large-Scale Composite Manufacturing
Tech Briefs
Glue Activated by Magnetic Field
Tech Briefs
Physical Strength Properties of Epoxy Adhesives
Tech Briefs
Epoxy Gel Super Charges Electronic Applications
Tech Briefs
Product Spotlight: Supreme 3HTND-2DM
Tech Briefs
Max's Out Of This World Adventure
Tech Briefs
Adhesive Academy: Heat Curing 101