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How to Use EP4EN-80 for Potting & Encapsulation Applications

With its thin bond line thickness and low viscosity, EP4EN-80  is ideal for bonding, encapsulating and potting applications. Watch a real-life demonstration of how this epoxy compound can be used while observing its flowability and ease of use.

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Materials

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    Transcript

    00:00:00 [Music] master bond ep4en-80 is a one-part fast curing epoxy for bonding and small encapsulation applications this system is nasa low outgassing approved and can be cured at temperatures as low as 80 degrees celsius unlike conventional one component heat

    00:00:31 curing systems it features a quick cure profile at 65 degrees celsius for 90 minutes followed by 30 minutes at 80 to 85 degrees celsius when used as an adhesive ep-4en-80 can be applied in thicknesses as thin as 10 to 15 microns its ultra low viscosity of 600 to 1800 cps

    00:00:55 and minimal shrinkage makes it suitable for small potting and encapsulations up to about a quarter inch thick protecting components from moisture dirt and dust due to its ultra fine particle size biller material this system offers unique gap-filling and heat transfer capabilities ep-4en-80 maintains excellent thermal

    00:01:18 conductivity and electrical insulation properties upon curing as well as a compressive strength of 24 000 to 26 000 psi and an ultra high tensile modulus of one million two hundred thousand to one million four hundred thousand psi at room temperature for more information or to discuss your application

    00:01:40 contact us today