A Guide to Wire Bonding

Wire bonding is a crucial technology for establishing connections between semiconductor dies and circuit boards. It is a constantly advancing field, driven by the electronics industry’s demands for miniaturization and compact design. Wire bonding can allow for higher performance and computing power to be achieved, enabling high-performance sensors and lighting, and unlocking the full potential of wide-bandgap semiconductors for high-power, high-density power conversion.

Possessing the appropriate PCB design tools and the expertise to accurately model wire bonds has become increasingly important. In this whitepaper, you will learn about the technology itself and how it can be used in a real-life design using Altium Designer. This proficiency will allow you to leverage the full potential of wire bonding and continually push the boundaries of innovation in electronics.

---