As modern automative designs increasingly integrate higher-speed electronics, advanced driver assistance systems, and complex on-board computers and sensors, electromagnetic interference (EMI) issues grow. Discovering EMI failures late in the design process can be a significant challenge, often resulting in increased costs, last-minute design changes, and delayed time to market.
This 60-minute webinar will explore how simulation‑based methodologies can be used to mitigate these costly EMI issues, enabling engineers to predict, diagnose, and resolve interference issues earlier in the development cycle. Attendees will learn how EMI issues can be modeled at various scales — from basic electrical and circuit-based modeling to component, cabling, and PCB level study, and finally to full system-level analysis. The session also will examine how simulation can be used to quickly gain useful engineering insights into underlying design problems and how this information can be used to build confidence in potential solutions and determine optimal mitigation strategies faster than build and test allow. Additionally, signal integrity and power integrity analysis will be discussed as these analyses often provide clues to EMI remedies.
Key topics:
- Electromagnetic interference/compatibility
- Signal integrity
- Power integrity
An audience Q&A session will follow the technical presentation.
Speakers:
Robert Towne, Manager – Application Engineering, Ansys
Robert Towne is a Manager of Application Engineering at Ansys, part of Synopsys. With more than 12 years of simulation experience, his current work focuses on using computational electromagnetics to analyze and validate printed circuit boards and other complex systems in the areas of signal integrity, power integrity, and electromagnetic interference. In addition to industry experience in high-tech, his work has spanned across multiple domains including automotive, industrial, and aerospace applications. His role within the high-frequency electromagnetics team has him supporting multiple toolsets including SIwave, HFSS/3D Layout, Circuit, and Q3D.
Moderator:
Amanda Hosey, Editor, SAE Media Group
