Anew mid-bus probe for the Summit™ T3-16 Protocol Analyzer from LeCroy (Chestnut Ridge, NY) can be connected to systems that utilize the Intel® mid-bus probe footprint specification. The probe uses a full-size connector that supports PCle® x8 lanes at 8 GT/s. Two mid-bus probes can be connected to a Summit T3-16 Analyzer and will support x16 lane widths. These probes can be used in conjunction with the unique lane swizzling feature on the Summit T3-16 Analyzer, which allows probe signals to be reorganized logically, to give developers flexibility in PCB layout.

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