EV Group (St. Florian, Austria) has announced the EVG620HBL Gen II, the second-generation, automated mask alignment system for volume manufacturing of high-brightness light-emitting diodes (HB-LEDs).
The EVG620HBL Gen II includes an enhanced microscope-supporting automated mask pattern search. An updated robotic handling layout also has wafer mapping capability. The device includes a line alignment function, which leverages the grids that mark single LEDs for orientation.
Built on EVG’s mask aligner platform, the EVG620HBL series features a high-intensity ultraviolet (UV) light source and an optional filter fan unit. The tool provides a wafer throughput of up to 165 six-inch wafers per hour (up to 220 wafers per hour in first print mode). Special recipe-controlled microscopes are also available; illumination spectrum can be varied and optimized to ensure pattern contrast with various wafer and layer materials, including sapphire, silicon carbide (SiC), aluminum nitride (AlN), metal, and ceramic.
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