The Polymer System EP37-3FLF from Master Bond (Hackensack, NJ) resists cryogenic temperatures and thermal cycling. The two-component epoxy, which features a low exotherm, functions as a potting, encapsulating, and casting system, especially where wider cross section thicknesses are specified. Serviceable over the range of 4K to 250°F, EP37-3FLF cures at room temperature in 2 to 3 days or faster at elevated temperatures. The product offers a non-critical 1-to-1 mix ratio by weight or volume, and a low mixed viscosity of 1,400 to 1,500 cps. Additionally, users can work with a 100 gram mass of the adhesive at room temperature for up to 90 minutes.

EP37-3FLF has a bond shear strength exceeding 2,000 psi and a T-peel strength of 25 pli. The flexible epoxy has an elongation of 180% and superior electrical insulation properties with a volume resistivity of 1x1014 ohm-cm. It bonds to substrates including metals, glass, ceramics, rubbers, and many plastics.

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Photonics Tech Briefs Magazine

This article first appeared in the January, 2012 issue of Photonics Tech Briefs Magazine.

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