Processors

Mouser Electronics, Mansfield, TX, offers i.MX 7ULP applications processors from NXP Semiconductors. Based on Arm® Cortex®-A7 and Cortex-M4 cores with separate isolated domains, they include both 3D and 2D graphics processing units (GPUs). The processors provide 32 Kbytes of L1 cache instruction memory, 32 Kbytes of L1 cache data memory, and 256 Kbytes of L2 cache, as well as 512 Kbytes of SRAM.

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Image Sensor

ON Semiconductor, Phoenix, AZ, introduced the ARX3A0 digital image sensor with 0.3-Mega-Pixel (MP) resolution in a 1:1 aspect ratio. With up to 360 frames per second (fps) capture rate, the Back-Side Illuminated (BSI) rolling shutter sensor consumes less than 19 mW when capturing images at 30 fps and 2.5 mW when capturing 1 fps. The monochrome sensor is based on a 560 × 560 active-pixel array for sensitivity at near-IR wavelengths in no light or when lighting is non-detectable by the human eye.

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USB 3.0 Camera

Pixelink, Ottawa, ON, Canada, released the PLD7620 20-MP USB 3.0 camera incorporating the Sony IMX183 CMOS rolling shutter sensor. Available in color and monochrome, the 1” sensor format camera is suited for imaging applications where high resolution, improved sensitivity, and low noise are required. The Sony back-illuminated image sensor technology realizes a high QE at a small pixel size of 2.4 μm.

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Dimensioning System

The 3D-A1000 dimensioning system from Cognex Corp., Natick, MA, features smart camera technology for static and in-motion dimensioning. With 3D symbolic light and point cloud technology, the system can inspect a range of fast-moving and complex packages and handles high-speed motion, uneven transitions, curved conveyance, and colorful target surfaces. The system is factory-calibrated and ready for system integration.

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PIM Test Analyzer

Kaelus, Irvine, CA, introduced the battery-powered iPA-0707D 40W passive intermodulation (PIM) analyzer that supports multiple test scenarios. The rugged design can be operated via remote control with any WiFi-enabled phone, tablet, or laptop computer. An optional Range to Fault (RTF) module identifies the location of PIM and Return Loss sources. An intuitive touchscreen interface is available for local control, performing tests and generating site reports.

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Thermal Camera

Fluke Corp., Everett, WA, offers the TiX501 thermal camera that features an ergonomic design and a rotating screen to minimize glare outdoors. The touchscreen delivers 640 × 480 resolution. The camera makes temperature measurements to 650 °C and offers LaserSharp autofocus and 2x digital zoom. With 240° articulation, images can be collected from overhead, around corners, or under equipment.

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Photoelectric Sensors

AutomationDirect, Cumming, GA, offers 4-mm (smooth) and 5-mm (M5 threaded) round photoelectric sensors in a range of sensing distances in both diffuse and through-beam sensing configurations. The DC-powered metal sensors require minimal mounting space and are suited for a variety of short- or long-distance sensing applications. The sensors detect object presence when the target obstructs light traveling from the emitter to the receiver.

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Switches

ZF Electronic Systems, Pleasant Prairie, WI, introduced STEUTE Series ZS pull-wire switches for on/off control switching or opening/closing electrically operated doors or gates. Models are available with powder-coated aluminum or fiberglass-reinforced thermoplastic housings. Units feature positive-break NC contacts, IP65 or IP67 ingress protection, and EN ISO 13849-1 and cCSAus-compliance. Typical applications include machine starting, barrier gate, and overhead door control.

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Hardness Tester

Buehler, Lake Bluff, IL, offers the All-in-One VH3100 hardness tester, a fully automatic, preconfigured Vickers/Knoop hardness test system for micro to macro hardness testing. The tester includes DiaMet Enterprise hardness testing software, a personal computer, and a 24” full HD touch monitor. The tester features a 3-position virtual turret with one Vickers indenter and two measurement objectives, an automated X/Y sample stage (110 × 140 mm travel range), a camera for sample navigation and scanning, and image analysis.

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Image Sensor

The OG01A backside-illuminated, global shutter image sensor from OmniVision Technologies, Santa Clara, CA, has a pixel size of 2.2 microns. It combines PureCel® Plust-S pixel technology and Nyxel® near-infrared technology for consumer and industrial applications that need a global shutter to avoid motion blur. The 1-megapixel sensor provides 1280 × 1024 resolution at 120 frames per second and 640 × 480 resolution at 240 fps.

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Fluorescence Analyzer

The Vanta™ Element X-ray fluorescence analyzer from Olympus, Waltham, MA, offers high-throughput testing, allowing users to obtain clear material and grade ID in seconds and compare alloy grades on the instrument's screen. With a dual-core processor and Axon Technology™, the analyzer is IP54 rated for resistance to dust and moisture and constructed to pass a 4-foot drop test (MIL-STD-810G). The operating temperature is from -10 to 45 °C (14 to 113 °F).

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Wireless Gateway

SignalFire Wireless Telemetry, Marlborough, MA, offers the DIN Gateway V2, a 900-MHz wireless gateway with an integrated I/O capability for network connectivity of wireless and wired sensors, integrated Ethernet, and built-in automation. It features two digital inputs, two digital outputs, three analog inputs, and an optional gateway output module with eight analog and two digital outputs. It supports wireless configuration up to 240 remote nodes at 3+-mile typical range and interfaces via RS-232 Modbus RTU or Modbus-TCP (Ethernet).

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Tech Briefs Magazine

This article first appeared in the January, 2020 issue of Tech Briefs Magazine.

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