Low-Viscosity Plastic

BASF Corp., Wyandotte, MI, introduced Ultrason® P 2010 low-viscosity polyphenylsulfone for large, complex-shaped components that is available in transparent and opaque. In processing raw material, energy consumption and component weight can be reduced. The tool also fills up at lower injection pressures and processing temperatures. It features high chemical resistance, hot steam sterilization at 134 °C, inherent fire resistance, and resistance to combinations of aggressive cleaning agents and disinfectants, water, and extreme heat.

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Power Amplifier

The MAMG-100227-010 from MACOM Technology Solutions is available from Richardson RFPD, Geneva, IL. The broadband, two-stage, GaN-on-Si hybrid power amplifier module is a 10W device fully matched and covers a 225–2600 MHz frequency range. A gold-plated copper heat sink is attached to the bottom side of the laminate substrate. The package can be accessed from the top or the bottom. Features include 28V operation and 22-dB power gain.

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Aluminum Alloy

QuesTek Innovations LLC, Evanston, IL, introduced an aluminum alloy for additive manufacturing that provides high strength at elevated temperatures of 200 to 300 °C in the as-built condition. The powdered aluminum material does not require subsequent heat treatment. The alloy enables printing of lightweight components not currently possible with traditional manufacturing methods.

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USB Cable Assemblies

L-com, North Andover, MA, offers IP68-rated USB 2.0 cable assemblies and panel-mount connectors for extreme environments. The assemblies and connectors resist moisture, fine particulates, and vibration and feature gold contact plating for connections with repeated mating cycles. Other features include rugged molded backshells and RoHS compliance.

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Industrial PC

Beckhoff Automation, Savage, MN, announced the C6025 industrial PC with Intel® Core™ i U processor in a fanless device. The processor and cooling design enable fully passive heat dissipation via a heat sink on one side. The PC features up to four CPU cores, 4-GB DDR4 RAM (expandable to 8 GB), 40-GB M.2 SSD with 3D flash memory, one DisplayPort video connector, four USB 3.0 ports, and onboard Ethernet controller with 3 × 100/1000Base-T ports.

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Thermal Interface Material

Sarcon® GR80A-00-100GY from Fujipoly, Carteret, NJ, is a 1.0-mm-thick thermal interface material that delivers thermal conductivity of 13.0 W/m•K with a thermal resistance of 1.0 °C•in2/W. When placed between heat-generating components and a nearby heat sink, the silicone-based material completely fills air gaps between uneven components, board protrusions, and recessed areas. It is available in sheets up to 300 × 200 mm or can be diecut to fit exact application shapes.

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Chip Resistors

Stackpole Electronics, Raleigh, NC, offers CSSH Series current sense chip resistors that includes a 0.3-milliohm value in the 2512 size that is available in tolerances as low as 1% and TCR of 150 ppm, with a 3W power rating. The resistors feature temperature capability up to 275 °C and can be used for high-power electronics for steady-state currents of up to 77 amps.

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Connectors

Stewart Connector, Glen Rock, PA, released the RJ45 Press-Fit connector series designed to eliminate the use of soldering in the assembly process, which eliminates cold solder joints and solder flux contamination. The series includes both single and 1×2 port configurations that can accommodate 1G through 2.5G Base-T Ethernet speeds. They utilize a tab-up design and have multiple LED configurations.

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