Product 1

Green Laser

FOBA (Selmsdorf, Germany) has developed a 532 nanometers wavelength green laser marking system which offers new possibilities for industrial direct part marking. The FOBA V.0071-gr and FOBA V.0141-gr green laser marking systems close the gap between UV (355 nm)- and fiber (1,064 nm)-laser markers. The combination of relatively high laser power and a vanadate source enables extended applicability and high speed. The new marking laser is available with either 7- or 14-watt laser power variations. It can flexibly be integrated into production environments due to a smaller marking unit (compared to the UV-laser), a broad range of available interfaces and five possible marking field sizes.

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Product 2

Time-of-Flight (ToF) Camera

The new model in Basler's (Ahrensburg, Germany) blaze ToF camera family combines high precision, low power consumption, low heat generation, a compact IP67 housing, and near-infrared operation at 850 nm. With its large 67° x 51° field of view and a working distance ranging from 0.3 to 10 meters, the camera can capture depth data of large objects and entire scenes at once. As with the blaze 940 nm camera variant, the new 850 nm model's Sony IMX556-DepthSense™ sensor provides precise 2D and 3D data in one shot, consisting of distance, intensity, and confidence maps. The light source (VCSEL diodes) and lens are already integrated in the new variant, enabling precise 3D measurements based on the time-of-flight method.

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Product 3

Ultraviolet Machine Vision Cameras

SVS-Vistek GmbH (Gilching, Germany) introduced its new fxo487 series of ultraviolet cameras with a maximum frame rate of 194 frames-per-second (fps) and 8.1MP resolution (2840 x 2840). SVS-Vistek fxo487 cameras leverage the Sony IMX487-AAMJ-C CMOS sensor with global shutter and variable charge-integration time. The sensor's UV waveband (200nm to 400 nm) achieves high sensitivity and low dark current characteristics. The fastest model in the series features two CoaXPress-12 interfaces, which ensure fast and lossless transfer of the high data volumes generated as well as low trigger latency. In addition to CoaXPress-12 cameras, the series will be rounded out with an 10GigE interface version of the fxo487.

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Product 4

Area Scan Cameras

Teledyne DALSA (Waterloo, Canada) announced its new Falcon™4-CLHS M6200 and M8200 cameras, based on Teledyne e2v’s Emerald 37M and 67M monochrome sensors. The new Falcon4-CLHS models deliver higher resolution, added functionality and ease of use with a CLHS interface that has been engineered for industrial imaging applications requiring high-speed data transfer. These models can reach multiple thousands of frames per second in either partial scan mode, or when using the Multi-ROI mode, with up to 32 distinct regions of interest. Additionally, the updated firmware enables appending detailed meta data to each ROI linked to different light sources.

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Product 5

AI-Capable Microprocessor

Renesas Electronics Corporation (Tokyo, Japan) has expanded its AI-capable RZ/V Series of microprocessors (MPUs), with a new device that enables AI processing of image data from multiple cameras. Equipped with two 64-bit Arm® Cortex®-A53 cores, the new device can deliver high computing performance with a maximum operating frequency of 1GHz. The RZ/V2MA features a proprietary low power DRP-AI (Dynamically Reconfigurable Processor) accelerator which can process vision AI at 1 TOPS/W (tera operations per second, per watt) class performance. The RZ/V2MA device offers high-speed interfaces such as Ethernet, USB, and PCI Express that allow image input from multiple external cameras.

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