Figure 1 depicts some aspects of an apparatus and method for automated serial sectioning of a specimen of a solder, aluminum, or other relatively soft opaque material. The apparatus includes a small milling machine (micromiller) that takes precise, shallow cuts (increments of depth as small as 1 μm) to expose successive sections. A microscope equipped with an electronic camera, mounted in a fixed position on the micromiller, takes pictures of the newly exposed specimen surface at each increment of depth. The images are digitized, and the resulting data are subsequently processed to reconstruct three-dimensional (3D) features of the specimen.
This method affords advantages over a related prior method in which a specimen was repeatedly cut on a micromiller, then dismounted, etched, photographed through a microscope, then remounted on the micromiller for the next cut. One advantage is elimination of much of the positioning uncertainty, and hence the uncertainty in registration of features seen at different depths, that arises from repeated mounting, dismounting, and photographing at a location different from the milling location.
Another advantage is automation of alignment of the images acquired at different depths. In the prior method, images were aligned, after they were recorded, in a procedure that was at least partly manual and hence time- consuming. In the present method, alignment is performed as an integral part of processing of the image data.
Once the image data from all sections have been recorded, they can be processed by readily available image-data-processing software, then combined to construct digital representations of three-dimensional features inside the specimen (see Figure 2). As a result of automation of the sectioning process, it is now possible to take about 20 sections per hour from given specimen, whereas previously, at most 10 sections could be taken in a day.
This work was done by Jen Alkemper and Peter W. Voorhees of Northwestern University for Glenn Research Center. For further information, access the Technical Support Package (TSP) free on-line at www.techbriefs.com/tsp under the Physical Sciences category.
Inquiries concerning rights for the commercial use of this invention should be addressed to NASA Glenn Research Center, Commercial Technology Office, Attn: Steve Fedor, Mail Stop 4–8, 21000 Brookpark Road, Cleveland, Ohio 44135. Refer to LEW-16820.