The Wafer Scanner 3840™ from Rudolph Technologies (Flanders, NJ) is for inspection and metrology of back-end semiconductor manufacturing processes, including bumping, probing, sawing, and dicing. The WS 3840 Inspection System uses Rudolph’s laser triangulation technology to provide fast and accurate measurements of bump height and coplanarity. A time delay integration (TDI) line scan camera provides image-based macro defect inspection for wafer surface and bump, and measures 2D bump characteristics, such as diameter, shape, and placement accuracy.

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NASA Tech Briefs Magazine

This article first appeared in the July, 2008 issue of NASA Tech Briefs Magazine.

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