Laser Sensors

The optoNCDT 1750 laser sensors from Micro-Epsilon, Raleigh, NC, feature measuring ranges of 500 and 750 mm for fast, high-precision measurement tasks that require large measuring ranges. They are designed for industrial and automation applications, enabling measurements on difficult surfaces such as semi-transparent plastics and ceramics, PCB material, carbon, and glass fiber-reinforced plastics. The sensors operate almost independently of the material and color. Measured results can be obtained via analog or digital RS-422 interface.

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Miniature Fasteners

microPEM® MSOFS™ flaring standoffs from PennEngineering, Danboro, PA, attach and/or space components in compact electronic assemblies. They install permanently in thin panels of any hardness and material, including stainless steel, other metals, plastics, and printed circuit boards. They feature a minimal footprint for reduced centerline-to-edge designs, and reusable threads to accept mating hardware. The fasteners are made of 300 Series stainless steel in thread sizes #0-80, #2-56, and M1 to M2.

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Surge Resistors

The HPWC (high pulse withstanding chip) range of high-energy surge resistor products from TT Electronics, Woking, UK, are suited for protection and discharge applications in compact power supplies and power control circuits where a resistance tolerance of 5% is required. Available in four sizes from 0805 to 2512, the resistors withstand up to 6.5 kV peak for a 1.2/50 μs surge, and up to 3 kW for a 0.1 ms pulse. A compact PCB footprint minimizes use of the PCB area, and the absence of laser trimming means no current crowding.

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Electronics Printer

Optomec, Albuquerque, NM, offers the Aerosol Jet HD System, a compact, configurable production platform that can dispense a range of electronics materials with features as small as 20 microns. The material deposition solution is used to directly print functional electronic circuitry and components onto low-temperature, non-planar substrates, without the need for masks, screens, or subtractive post-processing.

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Frequency Synthesizers

Micro Lambda Wireless, Fremont, CA, released MLVS-Series frequency synthesizers for low-noise and fast-tune applications. A standard frequency model is available covering 500 MHz to 20 GHz, with options to cover down to 50 MHz and up to 21 GHz in a single unit. The standard model operates over the 0 to +65 °C temperature range, with extended temperature versions available. The frequency synthesizers have been designed in a miniature package that fits within a single-slot PXI chassis.

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3D Printer

Aleph Objects, Loveland, CO, introduced the LulzBot Mini 2 Desktop 3D Printer that features a belt-driven Z-axis that allows for rapid travel and accurate layer alignment, with no reduction in minimum resolution. Included as standard equipment are an Aerostruder Tool Head, LulzBot modular bed system with reversible heated glass/PEI surface, and a Graphical LCD Controller for tetherless operation. The printer supports a range of materials including PLA, ABS, nylon, co-polyester, and polycarbonate blends.

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In-Circuit Debugger

Microchip Technology, Chandler, AZ, introduced the MPLAB® PICkit™ in-circuit programming and debugging development tool with a voltage range of 1.2-5V and USB connectivity. The tool is suited for designs in the 8-bit space, as well as for 16- and 32-bit development, using a 300-MHz, ATSAME70Q21B microcontroller onboard. The tool connects to the user’s computer via a high-speed USB 2.0 interface, and can be connected to the target using an 8-pin, single inline header that supports interfaces such as 4-wire JTAG.

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Finite Element Analysis

The Multiphysics for IronCAD (MPIC) finite element analysis (FEA) extension from IronCAD, Atlanta, GA, features a new automatic tie/glue feature for assemblies that enables FEA analysis on CAD models that may contain intentional gaps or overlaps for welding or thermal expansion/shrinkage where traditional analysis previously required perfectly matched assemblies. Two-way synchronization between the analysis model and CAD model lets users work between both states while having clear visibility between the design components and components used for analysis.

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Single-Board Computer

Technologic Systems, Fountain Hills, AZ, announced the TS-7800-V2 single-board computer that is based on Marvell Armada 385 ARM Cortex A9 dual-core CPU technology. The general-purpose single-board computer is suited for smart devices, medical systems, plant automation, or any industrial embedded systems. Features include 1 GB RAM, 4-GB MLC eMMC Flash, Gigabit Ethernet networking with optional WiFi and Bluetooth, two USB 3.0 ports, 10 serial/COM ports, and operating temperature from -40 to 85 °C.

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Bonding Material

Rogers Corp., Chandler, AZ, offers RO4460G2 low-loss bondply with a 6.15 dielectric constant (Dk) that provides a 0.004” (0.101 mm) bonding layer. It provides a low z-axis expansion for plated through-hole reliability, and thermoset bond temperatures compatible with standard epoxy/glass (FR-4) processes. The bondply is suited for multilayer designs requiring sequential laminations since fully cured bondplies are capable of withstanding multiple lamination cycles. Each bondply has a UL V-0 flame-retardant rating, and is compatible with lead-free processes.

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Vision and Sensor Fusion Processor

Mouser Electronics, Mansfield, TX, offers the S32V234 vision and sensor fusion processor from NXP Semiconductors that supports computation-intensive applications in vision and sensor fusion applications. It combines CPU, GPU, and image processors to provide processing, vision acceleration, and security features. The processor integrates four Arm® Cortex®-A53 cores running at up to 1 GHz with a NEON coprocessor and an Arm Cortex-M4 CPU. The processor offers 4 MBytes of on-chip system RAM and two 32-bit DRAM controllers.

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CAD Software

Creo 5.0 computer-aided design (CAD) software from PTC, Needham, MA, enables concepts to be transformed into smart, connected products with augmented reality (AR) capabilities. Other new features in topology optimization, additive and subtractive manufacturing, computational fluid dynamics, and CAM also are included. The new Creo Mold Machining extension provides dedicated high-speed machining capabilities optimized for molds, dies, electrodes, and prototype machining. Design enhancements include geometry creation with sketch regions, and volume helical sweeps.

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Metal 3D Printing Simulation

ANSYS, Pittsburgh, PA, released ANSYS® Additive Print™ and ANSYS® Additive Suite™ for metal additive manufacturing, enabling users to print lightweight, complex metal parts, and analyze microstructure properties and behavior. By incorporating simulation prior to the printing process, designers can design, test, and validate the performance of a part at the design stage. ANSYS Additive Suite enables designers to optimize weight reduction and lattice density; create, repair, and clean up CAD geometry; simulate the additive process; and conduct structural and thermal analysis for data validation.

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Tech Briefs Magazine

This article first appeared in the June, 2018 issue of Tech Briefs Magazine.

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