Two short reports describe a micromachined quantum-mechanical-tunneling accelerometer and radiation-hardened support electronics designed for use in outer space. Like the micromachined tunneling accelerometers described previously in NASA Tech Briefs, this device is based on the use of electronic sensing/feedback control circuitry that measures acceleration in terms of an electrostatic-deflection voltage necessary to maintain a small constant distance (typically a few Angstroms) between a membrane and a tunneling tip in a mechanical acceleration-sensing/electron-tunneling device.
This work was done by Vardkes Victor Boyadzhyan-Sevak of Caltech for NASA's Jet Propulsion Laboratory. To obtain copies of the reports, "ATC Electron Tunneling Accelerometer Integrated Sensor Circuitry for Space Applications" and "Tunneling Accelerometer Multichip Module (Integrated Sensor) Thin Film Technology Radiation Hardened MCM," access the Technical Support Package (TSP)free on-line at www.techbriefs.com under the Electronic Compoments and Circuits category, or circle no. 188 on the TSP Order Card in this issue to receive a copy by mail ($5 charge).
In accordance with Public Law 96-517, the contractor has elected to retain title to this invention. Inquiries concerning rights for its commercial use should be addressed to
Technology Reporting Office
Mail Stop 122-116
4800 Oak Grove Drive
Pasadena, CA 91109
Refer to NPO-20013, volume and number of this NASA Tech Briefs issue, and the page number.
This Brief includes a Technical Support Package (TSP).
Micromachined tunneling accelerometer for use in outer space
(reference NPO20013) is currently available for download from the TSP library.
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