Multicore® LF600, a halide-free, no-clean Pb-free solder paste from Henkel (Düsseldorf, Germany), has been designed for humidity-resistance, making it best suited for varying manufacturing climates. Its formula allows for printing and reflow performance in regions where temperatures are upwards of 30°C (86°F) with 80% relative humidity. Multicore® LF600 features a new activator chemistry that combines coalescence with ultra-low voiding to deliver longterm, in-field reliability results.

In addition, the material has been designed with an innovative gelling technology that enables zero hot slump, thereby eliminating any issues with mid-chip solder beading. Its highly stable solvent system delivers an open time of 24 hours and an abandon time of 4 hours, eliminating material waste and enabling continuous cycling for up to 24 hours with no degradation in print quality. Multicore® LF600 is available for stencil printing down to 0.4mm pitch QFP and 0.4mm CSP devices and is highly effective on a wide range of surface finishes including Ni/Au, Immersion Sn, Immersion Ag, and OSP Copper.

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Embedded Technology Magazine

This article first appeared in the July, 2007 issue of Embedded Technology Magazine.

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