Nextreme (Research Triangle Park, NC) has developed the eTEC™, an advanced thin film embedded thermoelectric cooler designed to address thermal management needs of the electronics, photonics, bio-tech, defense, and aerospace industries. The eTEC functions as a miniature, solid-state heat pump and is ideal for cooling hot spots that result from localized areas of high heat flux on an IC. The device pumps a maximum heat flux of 150 W/cm2 with some designs delivering as much as 400 W/cm2. Nextreme's eTECs can operate in a high COP (Coefficient of Performance) regime and still pump a heat flux of 50-100 W/cm2.

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Embedded Technology Magazine

This article first appeared in the November, 2007 issue of Embedded Technology Magazine.

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