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Emerson Network Power (Tempe, AZ) has released the Centellis™ 500, a fully deployable MicroTCA™ system that uses innovative plastic packaging, and Emerson's MicroTCA Carrier Hub (MCH) and high-performance processor module. Made of an injection molded plastic enclosure that houses a MicroTCA backplane, fans, power module, MCH, PrAMC 7211 processor Advanced Mezzanine Card, and three additional AMC payloads, the Centellis 500 supports a number of enterprise-level applications. These include IP-PBX, Packet Processing, VoIP Gateway, Network Point of Sales, Industrial Automation, Access Router, WiMAX, Telemedicare, Remote Radiology, and Patient Monitoring.

Development and deployment will be accelerated by Emerson's SpiderWareM3 Graphical User Interface-based platform management, monitoring, and maintenance software for quick system configuration and ease of use. The product enables engineers to develop MicroTCA applications that may previously have been cost-prohibitive for the enterprise, medical, and industrial automation industries.

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