Congatec AG (Deggendorf, Germany) and SECO (Arezzo, Italy) have jointly created a new form factor for embedded computing. The Qseven format will complement the low power and small size of next-generation embedded processors built using 45nm technology. The Qseven format offers high-performance computing power delivered in a board measuring just 70mm × 70mm
The new form factor has a maximum power consumption of around 12W specified in the standard. Where heat dissipation is an issue, a thermal cooling interface helps transfer any heat generated to a cooling solution. The platform will also provide extensive connectivity through industry standard interfaces, including: 4× PCI Express, 2× SATA, 6× USB 2.0, 1× 1000BaseT Ethernet, 2x SDIO 8 bit, LVDS 2× 24 Bit, DVO/SDVO (shared), VIP (Video Input Port), HDA (High Definition Audio), I2C Bus, and LPC (Low Pin Count Bus).
The form factor offers flexibility in configuration. By leveraging the Mobile PCI Express Module connector format, Qseven offers three different connector heights, from 4.3mm to 7.8mm. Typical applications will include automation and DIN rail systems, automotive, and anywhere an ultra mobile embedded computing system is required.
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