The VT-S700 in-line automated optical inspection system from Omron Electronics, Schaumburg, IL, shortens tact time of soldered component inspection with an expanded field of view. Using a telecentric lens with a 2-megapixel camera, the system reduces image distortion at the edges of the field of view. It delivers high-resolution inspection of up to 10 microns for components as small as .01005, and down to a 12-mil pitch. The system uses a three-color highlight system that illuminates the printed circuit board in a 360-degree dome. The 3-CCD camera enhances solder shape recognition accuracy and identifies lead-free solder joints. Auto-teaching modes automatically extract components based on model pattern data, and logic customization allows the system to adapt to future changes in component shapes and solder types. Optical character verification capability is available, and resolution can be selected for 10, 15, or 20 microns.

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Imaging Technology Magazine

This article first appeared in the June, 2009 issue of Imaging Technology Magazine.

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