Goodfellow (Coraopolis, PA) recently announced a new range of perovskites, a group of materials that demonstrate great potential for optoelectronic applications. Perovskites have a unique and versatile crystal structure that consists of a variation in the chemical formula ABX3. Many perovskites occur as oxides (ABO3), where A and B are typically metal cations. Due to their lattice, these materials are characterized by special properties like superconductivity, magnetoresistance, piezoelectricity and dielectric and pyroelectric behavior.

Goodfellow’s range of perovskites include powder and solid forms of: barium titanate, bismuth aluminate, bismuth titanium oxide, calcium titanate, copper tungsten oxide, lithium titanate, lead titanium oxide, lanthanum titanate, and samarium ferrite.

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TDI-Based Cameras

Detection Technology (Espoo, Finland) has expanded its portfolio to TDI (Time Delay Integration) technology and launched a TDI-based camera family called X-Scan T for industrial inspection. The X-Scan T is built on a modular platform that is easy to scale for a variety of system configurations. Equipped with a built-in control unit, embedded TDI algorithm and other data processing functions, the X-Scan T is a true plug-and-play type of detector solution. The series comes with robust mechanics, reliable industrial connections, and bidirectional scanning operation for improved usability.

The TDI technology features high sensitivity and enhanced contrast resolution. The photodiode-based sensor, the fast and sensitive scintillator, and the signal processing chain, which is capable of reading each single pixel, further boost the imaging performance of the detector family. The low-dose operation mode also enables the minimization of shielding and thermal cooling of X-ray systems for reducing total life cycle costs by 20% and streamlining system designs.

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Renesas (Tokyo, Japan) recently introduced the RV1S92xxA and RV1S22xxA devices, the world’s smallest isolation devices for industrial automation and solar inverter applications. Designed for DC to AC power inverters, AC servo motors, programmable logic controllers, robotic arms, solar inverters, and battery storage and charging systems, the new RV1S92xxA and RV1S22xxA photocouplers offer designers a variety of functions and the layout flexibility to significantly shrink equipment size.

In addition, the RV1S9260A 15 Mbps communications coupler and RV1S9213A intelligent power module driver are the first photocouplers to use tiny LSSO5 packages with a 0.65 mm pin pitch – half the pitch of conventional packages. All five new devices adhere to the strict UL61800-5-1 standard for motor drive equipment, and the UL61010-2-201 standard for control devices such as PLCs, enabling manufacturers to design a new generation of high voltage systems for their smart factories.

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High-Power UV-LED Systems

Innovations in Optics, Inc. (Woburn, MA) offers solutions that pair highpower UV-LED illuminators with precision driver/controllers for Digital Light Processing (DLP®) applications in 3D printing and maskless photolithography. The UV-LED technology offers more reliable and economical advantages over lasers and arc lamps in UV DLP systems. Optical power from these UV-LED systems can exceed 35 Watts of incident flux onto the active area of the DLP.

The Model 3300 series of UV-LED illuminators for DLP comprise a densely packed UV-LED array. The illuminators are optimized to support the larger of TI’s chipset families, DLP7000, DLP9000, and DLP9500. Standard LED center wavelengths range from 365 nm to 435 nm. Single or multi-wavelength configurations are possible. Up to 18-die integrated into the UV-LED array of the 3300 series illuminators can be driven and modulated independently. Recirculated liquid-cooling allows the UV-LED array to be operated at a very high current density.

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Precision Fiber Alignment Arrays

Optoscribe Ltd (Livingston, UK) has announced the launch of OptoArray™, its new range of precision optical fiber alignment structures. OptoArray™ solutions can help reduce losses in optical circuits through the precise and stable alignment of fibers. This is particularly important given the demand for increasing levels of high density optical fiber in applications including multi-fiber connectors, arrays for interfacing to optical switching hardware such as reconfigurable optical add drop multiplexers (ROADMs), and interfacing to other free-space optical systems.

Optoscribe’s high-speed laser-based manufacturing process provides full 3D flexibility in the patterning of holes and can create high-precision, highly controllable microstructures in glass. In addition, the 3D control provides the ability to shape the hole entrance creating a funnel or conical taper to allow for easy insertion of the fibers. Holes can also be formed at arbitrary angles to the surface of the glass, such as the 8 degrees typically used for minimizing back-reflections.

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High-Speed Infrared Detection Module

Boston Electronics (Brookline, MA) recently announced the UHS-M, a high-performance, high bandwidth detector/preamplifier module from partner company Vigo. Bandwidth is a minimum of 1 GHz with detector sensitivity from 3 to 11+ um. Applications include fast pulsed laser measurements, dual-comb spectroscopy, free space optical communication, etc. The UHS-M module is self-contained in one package with the IR detector, preamplifier, TEC controller and power supply.

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