Automotive Camera Monitor System

The KTM X-Bow GTX and GT-2 race cars rely on a latency-free camera monitor system.

Instead of classic side mirrors, the new KTM X-Bow GTX and GT-2 race cars rely on a latency-free camera monitor system (CMS) from Kappa optronics GmbH (Gleichen, Germany). The high-tech system with two CMOS cameras and two screens on the right and the left of the vehicle and in the cockpit is aerodynamically optimized.

This technology is designed specifically for race cars, but will also be approved for road traffic. Whether in low sun, blinding headlights or darkness, the sophisticated sensor technology offers drivers superior performance in any racing situation. Particularly important for race cars is the extremely wide field of view for superior side visibility. Dispensing with classic side mirrors also enables optimized aerodynamic vehicle design.

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Curved CMOS Imaging Sensors

SILINA’s curving process works for both CMOS and CCD.

In nature, most vision systems use curved retinas, like human eyes. Unfortunately, all electronic imaging systems use flat imaging sensors which require making the lens very complex, using many expensive optical elements. One month after being founded, SILINA (Paris, France) has successfully curved 275 units of 1-inch CMOS imaging sensors at the same time. SILINA’s curving process works for both CMOS and CCD. It can be applied to front-side illuminated (FSI), back-side illuminated (BSI) sensors, and on various spectral bandwidths from ultraviolet, visible to infrared. The process enables low-volume and high-volume manufacturing, curving one sensor, several sensors or a full wafer at a time. Available shapes are: spherical, aspherical, freeform and custom shape on-demand.

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SEM MultiVac Module

MultiVac operates in N2 and H2O atmospheres.

TESCAN ORSAY HOLDING a.s. (Brno, Czech Republic) released its new MultiVac module to provide the option for adding low vacuum and variable pressure capability to TESCAN SEMs.

Varying the inchamber atmosphere is an established technique for mitigating charge, imaging samples in their native states and, in combination with a gaseous secondary electron detector (GSE), enabling high-magnification topographic imaging at low keV or low beam current.

MultiVac operates in N2 and H2O atmospheres, as well as at extended variable pressure (3–500 Pa). MultiVac’s GSD, when used in H2O atmosphere, excels at enhancing contrast and enabling high-resolution imaging at low keV and low current for detailed topographic characterization.

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Femtosecond Fiber Laser

The 1030 nm high-power femtosecond fiber laser

Jasper from Fluence Technology (Warsaw, Poland) is a 1030 nm high-power femtosecond fiber laser, delivering pulses with energy up to 100 µJ and 60W of average power. With a truly monolithic all-fiber front-end, this laser provides fast warmup time, unprecedented long-term stability, and hands-free operation. Contrary to free space laser amplifiers, fiber amplifiers ensure superior beam pointing stability even in harsh environments. Internal repetition rate is 200 kHz - 20 MHz. Pulse duration is less than 250 fs (FWHM). Central wavelength is 1030+/-5 nm. Optional wavelength outputs with a Harmonic Generation Module (HGM) are: 515 nm, 343 nm and 258 nm.

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Thick Film Chip Resistor Arrays

The CATxxA-LF, CAYxxA-LF, and CAYxxA-AS series increase available board space and reduce costs.

Bourns, Inc. (Riverside, CA) announced several new AEC-Q200 compliant thick film chip resistor array model families. Bourns designed the new surface mount model CATxxA-LF, CAYxxA-LF, and CAYxxA-AS series to help increase available board space and reduce costs. The Model CAYxxA-AS series meet both the AEC-Q200 standard and anti-sulfur protection requirements based on the ASTM-B-809-95 and EIA-977 (test parameter B) standards, making them suitable for use in power supply and LED lighting applications that operate in extreme conditions. The new AEC-Q200 compliant Model CATxxA-LF concave and CAYxxA-LF and CAYxxA-AS convex chip arrays are available in 1 mm and 1.6 mm widths and contain two or four pieces of isolated thick film resistive elements printed onto a single ceramic substrate.

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Evaluation Board

The EXT3 extension kit and evaluation board

Pervasive Displays (Tainan City, Taiwan) has introduced the EXT3 extension kit and evaluation board, with support for its entire range of iTC ultra-low power e-paper displays, along with software libraries to help reduce its customers’ engineering effort. Many manufacturers are moving away from TN/STN displays to an ultra-low power e-paper alternative, where the image on screen can be maintained without consuming any power. The EXT3 helps engineering teams evaluate e-paper technology before making system-level decisions. This includes deciding which host microcontroller to use, what screen size and color to select, and the amount or type of memory needed.

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Gamma Detection and Identification System

The APEX gamma detection and identification system

Rock West Solutions (RWS) (Santa Barbara, CA) launched a new product this month called APEX, a high-performance gamma detection and identification system comprised of a handheld detector and accompanying analysis software. This device has 5-10x higher resolution than most traditional handheld detectors due to the incorporation of commercial-grade CZT crystals. APEX captures gamma counts, assembles a full energy spectrum, and interfaces with a Windows laptop running the APEX analysis software. The APEX GUI displays the collected spectrum with user-friendly isotope identification tools. RWS uses commercial-grade CZT crystals with cutting-edge electronics designed to provide an economical, high-performance gamma detection and spectroscopy solution. Gamma resolution as low as 1.25% at 662 keV is achievable.

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APDs and SPADs

X-FAB's new APDs and SPADs

X-FAB Silicon Foundries (Tessenderlo, Belgium) has just introduced its latest generation of avalanche photodiode (APD) and single-photon avalanche diode (SPAD) devices. Leveraging its 180 nm XH018 high-voltage process, X-FAB’s new APDs and SPADs benefit from architectural modifications, boosting performance in relation to the photon detection probability (PDP). There is a 42% PDP figure for incident light at 405 nm, while further up the spectrum in the near-infrared (NIR) frequencies the improvement is as much as 150%, with a 5% PDP being demonstrated at 850 nm. An afterpulsing probability of 0.9% has been achieved which represents a 70% reduction compared to the first-generation devices. The dark count rate (DCR) is only 13 counts/s/µm2.

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Multi-Sensor Vision System

The AVR300 Multi-Sensor Vision System

The L.S. Starrett Company (Athol, MA) has enhanced its AVR300 Multi-Sensor Vision System with a 0.14 magnification lens featuring the largest field of view to date on the AVR Series at 2.36" x 1.90" (60 mm x 48 mm). Due to “superimage” technology, which allows multiple images to be stitched together to form one larger image, together with the system’s touch probe technology, the AVR-FOV 0.14X can accurately inspect a wide range of features on large or complex parts, as well as on multiple small parts. The AVR-FOV 0.14X automated part programs deliver accurate results to the micron level in a matter of seconds with “Go/ No-Go” tolerance zones, and data are provided in one easy-to-interpret report. The AVR-FOV 0.14X has an X-Y-Z travel of 12" × 8" × 8" (300 mm × 200 mm × 200 mm).

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UV-Enhanced Detector

The UVG20S photodiode is ideal for UV detection between 190 nm to 400 nm spectral wavelengths.

Opto Diode Corporation (Camarillo, CA) announced an ultraviolet-enhanced detector featuring a 5.5 mm diameter active area. The UVG20S photodiode is ideal for UV detection between 190 nm to 400 nm spectral wavelengths with a full spectrum of 190 nm out to 1000 nm. The device features stable responsivity over wide temperature ranges and features 100% internal quantum efficiency from 200 to 400 nm. The photodetector is packaged with a UV quartz window that is epoxy-bonded in place. Under test conditions at 254 nm, the UVG20S detector’s responsivity ranges from 0.105 A/W (minimum) to 0.115 A/W (typical). Shunt resistance is 100 MOhms (typical) and reverse breakdown voltage is 50 volts (typical). At 0V bias, capacitance is 1.5 nF (typical) and response time is 4 microseconds (typical).

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52 GHz Bandwidth Socket

coThe SG25-QFN-2017 socket is designed for a 4 mm × 4 mm package size.

Ironwood Electronics (Eagan, MN) recently introduced a new high-performance, low-profile elastomer socket for 0.5 mm pitch QFN packages. The SG25-QFN-2017 socket is designed for a 4 mm × 4 mm package size and operates at bandwidths up to 52 GHz with less than 1dB of insertion loss (GSSG configuration). The contact resistance is typically 20 milliohms per pin. Network analyzer reflection measurements for the G-S-S-G case were taken with all except the pins under consideration terminated into 50 Ohms. The socket utilizes clamshell lid with an integrated spring-loaded compression plate that applies required force for connecting ICs to the system PCB. The socket also incorporates an open top with 150-degree view for the optical chip.

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Photonics & Imaging Technology Magazine

This article first appeared in the September, 2021 issue of Photonics & Imaging Technology Magazine.

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