Large Polished Optics

Precision Glass & Optics (Santa Ana, CA) offers precision optics on large polished substrates up to 30” in diameter. Customer specifications that can be applied to the large format glass include polishing up to 30", flatness/transmitted wavefront equal to Lambda/30 over any 6" diameter, with parallelism at 1 arc second, angles to 1 second, and surface roughness at 2 angstroms. The company’s scratch-dig specifications for prisms and other large optics are at 20/10, also known as “high precision” quality. With eleven continuous planetary polishers (CPs), including a state-of-the-art 96" CP, PG&O manufactures finished plano optical components with exceptional flatness and uniformity.

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Meniscus SAC

Focuslight Technologies Inc. (Xi’an, China) has announced the Focuslight Blue Meniscus slow-axis collimator (SAC). This new SAC with an effective focal length (EFL) of 9.7 mm has a concave-convex, acylindrical lens design for the collimation of the slow axis of laser diodes. Blue diode lasers continue to revolutionize the processing of different materials such as copper and aluminum. The high absorption of blue light compared to infrared light results in a great advantage for typical industrial applications such as cutting or welding. A material with low absorption is the key to prevent the detrimental effects of heating. In addition to material processing, other applications in medicine (bacterial treatment and surgery), lighting, or pumping also enjoy recent interest.

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3D Scanner

Evatronix SA (Bielsko-Biala, Poland) recently unveiled its latest eviXscan 3D Quadro+ scanner. Two scanning ranges allow both the precise measurement of small parts with very high accuracy and the rapid geometry measurement of large objects. The device’s inner range enables objects from 120 to 450 mm in size to be scanned efficiently. In case of the outer range the recommended size of the scanned objects is from 250 to 1000 mm. Quadro+ is equipped with high-resolution cameras: 9 Mpix for the outer range and 12 Mpix for the inner range. The combination of modern matrixes and lenses with low distortion level makes the scanner obtain as much as 350 ptk/mm2 in the inner range. The device has a new projector equipped with a blue LED light source in DLP technology, allowing it to obtain an image of 1080p resolution.

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Co-Packaged Optics Platform

Ranovus Inc. (Ottawa, Canada) recently demonstrated a co-packaged optics platform using a Xilinx Versal ACAP (adaptive compute acceleration platform) and Ranovus Odin™ 800 Gbps CPO 2.0. The joint demonstration between Ranovus and AMD highlights the arrival of the CPO 2.0 solution for AI/ML platforms that demand power efficient, high throughput and high-density optical interconnect. RANOVUS’ Odin™ scales from 800 Gbps to 3.2 Tbps in the same footprint by leveraging Ranovus’ 100 Gbps per lambda monolithic Electro-Photonic Integrated Circuit (EPIC) IP, laser platform, and advanced packaging technologies. CPO is an innovative approach that provides Nx100 Gbps PAM4 Optical I/O channels for Ethernet switch and ML/AI silicon in a single packaged assembly that significantly reduces the cost and power consumption of the complete system.

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OLED DDIC

Magnachip Semiconductor Corporation (Seoul, South Korea) announced that the company has commenced full-scale mass production of an organic light-emitting diode display driver integrated circuit (OLED DDIC) for OLED TVs. The new DDIC supports a maximum of 960 source output channels, and, coupled with a Chip On Film (COF) package and high-speed serial interface, it is an ideal solution for UHD OLED TVs. With Magnachip’s advanced technology for optimizing resolution, the new product supports various resolutions between HD (1,366 x 768) and UHD 4K (3,840 × 2,160). It also can be applied to different sizes of panels, ranging from 40 to 80 inches.

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High-Speed InGaAs Photodiodes

Fermionics Opto-Technology (Simi Valley, CA) introduced the ultra-compact FD80 Series of high-speed, low-dark-current, low-capacitance photodiodes. The innovative InGaAs product line is designed specifically for use in extremely tight spaces, such as high-speed communication systems. The FD80 series features a planar-passivated device structure with an 80 μm diameter active area on a vertical or horizontal-mount S8 ceramic package pigtail assembly in solderable surface-mount configurations. For added convenience, the high-speed indium gallium arsenide PIN photodiodes are coupled directly to a single- or multi-mode pigtail fiber. The devices are also available with an internal fiber tip angle which is polished for low back reflection, and other customizable options.

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3D Surface Inspection System

Chromasens (Konstanz, Germany) has introduced a 3D inspection system expressly designed for detecting imperfections on the surface of metal cylinder heads requiring large field of views. Leveraging the Chromasens 3DPIXA wave dual 30μm stereo line scan camera, the Chromasens Corona II LED illuminator with controller, and the Chromasens 3D Application Programming Interface (CS-3D-API), the turnkey imaging system achieves 100% inline inspection at frequencies up to 30 kHz at full resolution. Every part coming down a high-speed line can be imaged and inspected including larger parts requiring fields of view (FOV) up to 450 mm (17.8 inches) wide. Images are captured simultaneously in both 2D and 3D by the 3DPIXA wave dual camera at a GPU accelerated speed of 552 mm (21.7 inches) per second. Resolution up to 30μm is possible in 2D using the 3DPIXA wave dual camera, with object dependent height resolution up to 5.87μm.

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NanoRF Optical Modules

TE Connectivity (TE) (Harrisburg, PA) has introduced its NanoRF optical hybrid modules for the defense industry’s VPX-based embedded computing systems that require increased bandwidth and radio frequency (RF) signaling. The new hybrid modules feature high-density RF and optical connections within common connector module applications like radar, electronic warfare (EW) missile guidance and tactical communications, along with any other small footprint applications where high-frequency RF and optical signals are critical. The NanoRF optical hybrid module’s cable mechanical transfer (MT) and edge-mount transceivers provide additional modularity and options for implementation. Intermateability and interoperability among VPX suppliers is accomplished by multiple slot profiles and connector modules added to the VITA 65.0 and VITA 65.1 compliant backplanes and board-level profiles.

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Full HD Digital Microscope

The new F35 HD optical inspection system from INSPECTIS (Solna, Sweden) offers full HD 1080p, 60 frames per second lag-free video with true colors, bringing digital microscopy to a new level with more precise imagery of objects ranging from increasingly compact miniaturized electronic assemblies to medical devices. Thanks to its fast optics and large image sensor, F35 provides images of objects under inspection such as solder joints on electronic PCBs and metallic parts with minimum glare and reflections. Camera and lens attributes including optical zoom, lens aperture size, focus and color balance can be adjusted directly by integrated on-board controls, via INSPECTIS software, or through a range of remote-control consoles. The F35 offers a 35:1 motorized zoom lens with auto-focus and iris-controlled depth of field, and is supplied with a wide range of lenses, lights, and other accessories.

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Hydrogen Alpha (H-alpha) Emission Line Filters

Alluxa, Inc. (Santa Rosa, CA) announced the development of two Hydrogen Alpha (H-alpha) Emission Line Filters for astronomy applications. The novel 5 Cavity H-alpha Filter has a 50% BW of only 0.35 nm, a 1% BW of <0.6 nm, and a peak transmission of approximately 80% and is fully blocked to OD6 out of band. Alluxa’s 2 Cavity H-alpha Filter features an even narrower design with a FWHM of 0.12 nm and peak transmission of greater than 90%.

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Soft X-Ray and EUV Imaging Camera

Andor Technology (Belfast, UK) announced the launch of its new Marana-X platform for high energy physics. The product integrates the latest in scientific CMOS technology (sCMOS) designed specifically for ultrafast soft X-ray/EUV tomography and High Harmonic Generation (HHG) applications. Marana integrates the first “uncoated”, 4.2 Megapixel sCMOS sensor with >90% quantum efficiency in the 80 eV-1keV range, 74 frame/s full frame and superb dynamic range. sCMOS’ inherent shutterless technology addresses the inconvenience associated with traditional mechanical shutters lifetime and limited repetition rates. Moreover, the Marana-X features a convenient USB3 plug and play interface and a robust CoaXPress interface.

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