Final Vision Inspection (FVI) System
CyberOptics® Corporation (Minneapolis, MN) has launched the Multi-Reflection Suppression™ (MRS™)-enabled 3D MX3000 Final Vision Inspection (FVI) system for memory modules. The launch extends the memory module inspection system portfolio from 2D to 3D. With two high-resolution MRS sensors, the 3D MX3000™ memory module inspection system enables highly accurate, dual-sided final vision inspection and doubles productivity. Proprietary MRS technology meticulously identifies and rejects multiple reflections caused by shiny and reflective surfaces. Effective suppression of multiple reflections is critical for highly accurate measurements.
Pulsed and CW Laser Modules
OSI Laser Diode (OSIL) (Edison, NJ), has introduced the LCW/SCW series of high-power laser modules for pulsed or continuous-wave (CW) applications. The modules’ pulsed, high-peak optical power reaches up to 500 mW and the continuous-wave optical power operates up to 75 mW. The available wavelengths include the new 850 nm, joining the current family of 1310 nm, 1490 nm, 1550 nm, 1625 nm, and 1650 nm. The LCW/SCW series of laser modules are available in hermetically sealed, laser-welded packages. Thermoelectric coolers (TECs), temperature-sensing thermistors, and back-facet monitors are also packaging options for wavelength stability over a wide temperature range.
LiDAR Depth Camera
FRAMOS (Taufkirchen, Germany) now offers Intel’s first LiDAR device – the new L515 depth camera. The L515 is the world’s smallest and most power-efficient solid-state LiDAR depth camera with XGA resolution and a large range of 0.25m to 9m. It generates 30 frames per second with a depth resolution of 1024 x 768. It has a field of view of 70°x55° (±2°) and the ability to generate 23 million depth points per second. Under controlled indoor lighting, the L515 depth camera achieves a Z error of less than 20mm at maximum range. The short pixel exposure time of less than 100 ns minimizes motion blur artefacts even with fast-moving objects. Consuming less than 3.5 watts of power, the tiny LiDAR depth camera has an onboard vision processor, accelerometer, gyroscope, and Full-HD RGB sensor with a resolution of 1920 x 1080 pixels.
64 Megapixel, 0.8 Micron Image Sensor
OmniVision Technologies, Inc. (Santa Clara, CA) announced the OV64C, its first 64-megapixel (MP) image sensor featuring a 0.8-micron pixel size to enable high resolution smartphone cameras in a 1/1.7" optical format. Built on OmniVision’s PureCel® Plus stacked die technology, this sensor features type-2, 2x2 microlens phase detection autofocus (ML-PDAF) to boost autofocus accuracy, especially in low light. Output formats include 64 MP at 15 frames per second (fps), 8K video at 30 fps, 16 MP captures with 4-cell binning at 30 fps, 4K video at 60 fps and 4K video with EIS at 30 fps. Additionally, the OV64C supports 3-exposure, staggered HDR timing for up to 16 MP video modes.
8 µm Pitch, Dual-Band Infrared Imaging DROIC
Senseeker Engineering (Santa Barbara, CA) has announced the availability of the Oxygen™ RD0092, the world’s first 8 µm pitch dual-band digital readout IC (DROIC). The Oxygen RD0092 supports a 1280 x 720 frame size at over 500 fps and dual-polarity inputs to provide compatibility with all industry-standard direct-injection detector materials. In Infrared Search and Track systems, the global shutter mode and windowing capability enables an unlimited number of 32 x 32 windows at over 8000 fps to detect and track multiple objects in real-time. For Situation Awareness applications where threat detection is critical, High Dynamic Range Dual Integration mode can be used to expand the possible dynamic range over 110 dB.