Sarnoff Corporation (Princeton, NJ) has introduced Ultra-Sense™, a complete wafer processing solution. Ultra-Sense combines Silicon-on-Insulator (SOI) wafer technology with low-cost, scalable fabrication techniques to provide manufacturable back-illuminated image sensors. Ultra-Sense back-illuminated image sensors improve the performance and lower costs of high-resolution CCD or CMOS imaging systems for cell phone camera modules, digital still cameras, Ultraviolet (UV) and Deep UV, Visible, Near Infrared (NIR) inspection systems, spectroscopy systems, and surveillance systems.

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Photonics Tech Briefs Magazine

This article first appeared in the October, 2008 issue of Photonics Tech Briefs Magazine.

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