J. P. Sercel Associates (JPSA, Hollis, NH) has released the IX-200 series laser systems, available in DPSS solid-state and excimer UV laser configurations. The IX-200 ChromaDice™ DPSS version is a wafer dicing system suitable for wafer trimming and scribing applications. The process is tolerant of wafer warp and bow, and is suitable for all wafer types. The IX-200 excimer laser version is suitable for via drilling, micromachining, thin film patterning, and semiconductor packaging applications including LED liftoff.

The Class 1, fully enclosed ChromaDice™ is available in 266-nm or 355-nm UV-DPSS laser wavelengths; it can achieve cuts as narrow as 2.5 microns in width. It scribes up to 6" wafers, including sapphire LED wafers. The IX-200 ChromaAblate™ excimer laser configuration is available in a 248-nm wavelength, providing micromachining of polymers, ceramics, Si, GaN, and GaAs materials. An optional 193-nm beam package is also available for polymers that do not couple well with the longer UV wavelength.