J. P. Sercel Associates (JPSA, Hollis, NH) has released the IX-200 series laser systems, available in DPSS solid-state and excimer UV laser configurations. The IX-200 ChromaDice™ DPSS version is a wafer dicing system suitable for wafer trimming and scribing applications. The process is tolerant of wafer warp and bow, and is suitable for all wafer types. The IX-200 excimer laser version is suitable for via drilling, micromachining, thin film patterning, and semiconductor packaging applications including LED liftoff.

The Class 1, fully enclosed ChromaDice™ is available in 266-nm or 355-nm UV-DPSS laser wavelengths; it can achieve cuts as narrow as 2.5 microns in width. It scribes up to 6" wafers, including sapphire LED wafers. The IX-200 ChromaAblate™ excimer laser configuration is available in a 248-nm wavelength, providing micromachining of polymers, ceramics, Si, GaN, and GaAs materials. An optional 193-nm beam package is also available for polymers that do not couple well with the longer UV wavelength.

Photonics Tech Briefs Magazine

This article first appeared in the October, 2006 issue of Photonics Tech Briefs Magazine.

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