The controlled transfer of heat from a component to its surroundings is critical for the operation of many industrial processes. For example, cooling of electronics components is needed to maintain safe operation and extend operating lifetime, while quenching of materials from elevated temperatures is often required to develop specific microstructural features that provide prescribed properties.
Analysis of heat transfer under conditions where phase transformation occurs in the cooling fluid is more complex, and must consider the range of near-wall effects arising from film boiling, transition boiling, nucleate boiling, and pure convection. The near-wall boiling processes that strongly influence heat transfer from the part to the quenching medium operate on a scale that is many orders of magnitude smaller than the component size. To accommodate these different scales, the complex 3D physics near the wall are analyzed using sets of equations that are solved only on the walls of the component. Under these conditions, accurate analysis of the heat transfer can be obtained for the differential heat transfer rates into the gas or liquid phase and the effect of gas formation on the flow behavior (Figure 1).
The results show the variation in the thermal conductivity due to the multiphase flow resulting from forced fluid flow, and flow due to the liquid-to-gas phase transformation caused by the fluid boiling at the specimen surface. Using these analytical approaches, the fluid flow conditions can be modified to produce a more regular distribution of heat extraction from the hot component. This allows the development of quench conditions in which an even temperature gradient can be maintained, leading to more homogeneous microstructural variability within the final component shape and limited development of residual stresses in the component.
This work was done by Luke T. Gritter, Jeffrey S. Crompton (corresponding author), Sergei Yushanov, and Kyle C. Koppenhoefer of AltaSim Technologies using COMSOL Multiphysics. For more information, Click Here .