Low-loss dielectric materials are available. The hydrocarbon- based, fiber-reinforced composite sheets can be applied to printed circuit boards and IC chip packaging. The material has a very low dielectric constant and low dissipation factor up to GHz range frequencies, and is advantageous for emerging high-frequency electronics applications as a printed circuit dielectric sheet.

The matrix resin, excluding the reinforcing fiber, has a dielectric constant as low as 2.5, and dissipation factor of 0.003 at up to 5 GHz. Fabrication has been demonstrated using traditional organic solvent pre-pregging processes. The material is unaffected by high temperatures and high humidity, and its inexpensive raw materials reduce fabrication process costs. The composite sheets are particularly useful dielectric layers for printed circuit boards and cards operated at gigahertz frequencies.

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