Product Spotlight: Master Bond Adhesive UV22DC80-1
Master Bond UV22DC80-1 is a one part nanosilica filled system for bonding and sealing and coating applications in the aerospace, optical and electronic industries. This video demonstrates the epoxy based system’s unique dual curing mechanism of both UV light and heat, allowing it to cure dissimilar substrates and shadowed out areas. This low viscosity epoxy is passes NASA low outgassing testing and features exceptional optical clarity. Click here for more information.