Materials

EP4S-80: One Part, Silver Filled Epoxy for EMI/RFI Shielding

Master Bond EP4S-80 is a one component, silver filled epoxy for bonding, sealing and coating. This NASA low outgassing approved system cures at the low temperature of 80˚C and bonds well to a variety of substrates. Watch this video to see how this low viscosity compound can be dispensed through a syringe or brushed on to create a protective coating. Learn more here .


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