Embedded computing systems used in many military and industrial applications are trending toward higher heat fluxes and power requirements. As a result, performance is being hindered by thermal limitations. This is intensified by harsh ambient conditions experienced in many of today’s applications. The thermal path typically involves a heat spreader to get heat from the electronics components to the chassis rail, a retainer clamp/lock to mechanically and thermally couple the card to the chassis and heat spreading or dissipation from the outside of the enclosure.
This webinar will provide insight to enhance each level of the thermal resistance network, primarily by increasing the effective thermal conductivity with passive thermal technologies. This method is highly reliable and easy to retrofit into existing designs. High Conductivity (HiK™) conduction cards, enhanced thermal locks, and high conductivity chassis enhancements will be investigated as well as best practices for designing the ultimate air or liquid cooled heat sink. Viewers will come away with a strong understanding of passive technologies such as heat pipes, vapor chambers and ACT’s new ICE-Lok™ technology.
For more information on the presented active thermal technologies, please visit here.