Product development engineers are continually challenged to make the next-generation design of their devices smaller and lighter while increasing functionality. Next-generation sensors, power amplifiers, and FPGAs ensure that power consumption will continue to increase, and industrial designers are forced to be masters at packaging “10 pounds in a 5-pound bag.” What’s often overlooked is the thermal management required for those devices, which are now more powerful and typically packaged in a way to limit direct conductive or convective cooling.
When engineers move beyond a basic copper or aluminum heat sink, they’re tasked with learning about all the options for thermal management. A more powerful passive technology is often their first choice in order to avoid the added complexity and maintenance of fans or pumps. This 30-minute Webinar explains the basic principles of the technologies as well as the elements of designing them into their systems.
The Webinar also covers the following topics:
- Heat pipe design best practices
- Heat pipe modeling guidelines
- HiK™ benefits and implementation
- Phase change materials (PCM) best practices and implementation
An audience Q&A follows the technical presentation.
For more information on the presented passive thermal technologies, and any other thermal technology you’re considering in your design, please visit www.1-ACT.com .