On-Demand Webinars: Semiconductors & ICs

Ensuring COTS Semiconductor Reliability with Tin-Lead Robotic Hot Solder Dip


The trend towards sourcing of commercial off the shelf (COTS) components, combined with the European Union’s Restriction of Hazardous Substances (RoHS) directive, has resulted in the dominance of pure tin and lead-free solder alloys on semiconductor and other microelectronics terminations. This has prompted an emerging awareness within high-reliability, mission critical industries of failure modes affecting these components — electrical shorts due to formation of conductive 'tin whiskers' and solder joint fractures related to degraded metallurgical properties.

This webinar will focus on the ability of Robotic Hot Solder Dip (RHSD), conducted under the tightly-controlled tolerances outlined in industry standard GEIA-STD-0006 (“Requirements for Using Robotic Hot Solder Dip to Replace the Finish on Electronic Piece Parts”), to remove the risks associated with tin whiskers while enhancing solderability and solder joint reliability. Corfin’s RHSD process is administered to exacting tolerances that exceed the GEIA-STD-0006 standard while retaining repeatability in a high-volume manufacturing environment.

Speaker:

Donald Tyler, President and CEO, Corfin Industries LLC