Engineers are increasingly relying upon adhesive bonding to improve the mechanical performance of their structures and devices. For example, the automotive industry is using adhesives to make vehicles lighter and thus more fuel efficient. In the electronics industry, novel flexible and wearable devices are enabled by bonding dissimilar materials together. One of the primary challenges in designing adhesively bonded structures is predicting when an adhesive or bonded interface will fail.
In this 60-minute Webinar, Dr. Mark Oliver from Veryst Engineering will share two case studies of using the COMSOL Multiphysics® simulation software to predict the strength and improve the performance of adhesively bonded structures: a structural adhesive joint and a stretchable electronics device. Through these examples, he will provide a brief introduction to the method of cohesive zone modeling and the experimental methods used to calibrate these models.
This Webinar will be of interest to anyone concerned with the mechanical design of structures containing adhesives or bonded interfaces.
An audience Q&A follows the technical presentation.