White Paper: Electronics & Computers

Using Vacuum Impregnation to Fill Quality Gaps for Electronics Manufacturers


Often the most troublesome and critical problems are those that are least visible. That certainly is true of electronic components, such as connectors, coils and wire harnesses. In the manufacture of these components, tiny voids, leak paths and microscopic holes are unavoidable. These gaps, while often not readily discernable, can be disastrous when electronic products are operated in harsh environments. While they may initially be difficult to spot, the presence of these voids can be demonstrated by submerging the part in water and applying as little as 5 psi of air pressure to it. Air bubbles will pour out of the holes and gaps, making the leaks obvious.

One solution that has proven to be largely successful is vacuum impregnation. This technique is applied to everything from computer cables to windings for electric motors and portable wireless applications, where mechanical shock can cause connection failures.

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