White Paper: Electronics & Computers

High-Reliability PCB Design Tips for Aerospace and other Harsh Environments

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Designing for reliability involves a wide array of design choices, material selections, and carefully controlled manufacturing processes. Take a deep dive into how harsh environments can wreak havoc on your printed circuit boards and learn tips to safeguard your projects from being destroyed. You owe it to yourself and the end user(s) of your boards (sometimes one in the same) to ensure reliable and safe-operating boards for years to come. The quick-turn PCB experts from Advanced Assembly weigh in on ways improve your designs before they hit the production floor.

In this whitepaper, learn how the anisotropic Coefficient of Thermal Expansion (CTE) of some PCB materials can hurt your design and what to look for in a highly reliable material. While focusing on thermal management will help improve your board’s lifespan and reliability, it is just one part of the equation. You also have to make decisions that limit the temperature rise of your board by either limiting heat input or increasing heat-sinking.

In addition to thermals, small, often-overlooked factors come into play when designing for harsh environments. Do not leave something like via design or incorrect solder to be the reason for board failures. Via fill processes, solder thieving, outgassing, and via barrel failures are all explored and solved from a design standpoint in this paper along with an exploration of solder choices.

Please enjoy the whitepaper and do not hesitate to reach out with questions to Advanced Assembly.

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