White Paper: Semiconductors & ICs
Thermally Conductive Epoxies Optimize Electronic Assemblies
The use and selection process of thermally conductive epoxies can make or break your application. Too much heat can lead to component malfunction or premature component failure while the inability to stay below specified temperature limits may result in irreversible damage and permanent performance shifts. Master Bond’s white paper compiles the most important considerations for the selection of epoxies for efficient thermal management.
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