White Paper: Power
Potting Compounds Protect Electronic Circuits
Potting and encapsulation compounds are designed to completely enclose a component, module or PCB, which effectively shields the unit while providing structural support. There are a variety of potting formulations on the market today that suit the needs of diverse applications. Learn about the performance properties of each, plus the packaging options available, to see which is best suited for the manufacturing and assembly of your electronic device.
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