White Paper: Design
Ultra Low Thermal Resistance Adhesives for Electronic Applications
As advances in epoxy and silicone materials constantly evolve, manufacturers of advanced electronic systems will find that adhesives offer the ability to meet nearly any combination of requirements for thermal, environmental, and structural stability. As product manufacturers face greater challenges in assembling die, package, and other components into products able to cope with increasing heat loads, adhesives are particularly versatile for bonding, sealing and coating. Moreover, the use of filler materials in adhesives can help to fine tune the specific performance demands required to extend product lifestyles and meet manufacturing requirements. Learn more about why and how ultra low thermally conductive adhesives are the preferred fastening approach in applications requiring careful thermal management.
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