White Paper: Materials
Selecting Adhesive and Potting Compounds for High Power and High Frequency Electronics
Given the great demand in today's world for many advanced power and high frequency communications electronics, fabricating and assembling these devices involves using adhesives, die attached compounds, glob-top encapsulants, underfills and potting compounds. Engineers must be familiar with how these systems can affect design so that they meet and exceed performance objectives. Learn more about how adhesives aid in thermal management, and how the different chemistries may be better suited for differing applications.
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