White Paper: Materials
Protecting Chip on Board (COB) Devices with Glob Top Encapsulants
Glob top encapsulations are often preferred for their ability to protect chips without damaging fragile wires. They are formulated to exhibit specific physical properties such as electrical insulation, resistance to moisture and chemicals and thermal conductivity, to name a few. These encapsulants play a critical role in the successful manufacturer of many common consumer and industrial devices.
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