White Paper: Test & Measurement

Analyzing Thin Films for Semiconductor Development


Getting a complete analytical picture of ALD grown ultra-thin films is no easy feat. It requires multiple analytical techniques to look at the composition, thickness, surface coverage and band gap which are necessary to look at failure analysis of semiconductors or improve semiconductor performance. The Thermo Scientific™ Nexsa Surface Analysis System is able to combine 3 techniques that can get all these measurements from 1 instrument; XPS for composition and thickness, ISS to look at surface coverage and REELS to measure band gaps. See how when you download this application note.

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