Borescopes

GenScope, Inc. (E. Longmeadow, MA) introduces the MicroFlex, Micro SemiRigid, and MicroRigid ergonomic borescopes. With diameters of 0.6mm, the scopes are engineered for high speed inline and maintenance inspections in fast-moving aviation facilities. The MicroFlex GenScope has a durable fused quartz fiber optic image bundle that provides crisp, clear and bright images. The MicroRigid GenScope has a solid glass rod lens that runs the length of a rugged stainless probe. The MicroFlex and MicroRigid easily attach to advanced digital documentation systems.

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Ruggedized Lasers

Model ML301HD and Model MIL301HD ruggedized laser diode modules from Bea Laser Inc. (Elk Grove Village, IL) withstand vibration, chemical, impact, and dust conditions. Available in red or green laser beam output, these units are suitable in applications for metal forming equipment, punch presses, and heavy-duty saws where alignment, targeting, and positioning are of prime importance. Each liquid-resistant unit consists of the laser module, a molded connectorized cable assembly, and a DNN rail mount power supply. Output power is at 5mw with wavelengths of 650nm for the red, and 532nm for the green. Operating voltage is at 5VDC @ 30mA for the red and 300mA for the green.

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LED Driver

Linear Technology (Milpitas, CA) offers the LT3598, a 45V, 2.5MHz DC/DC boost mode converter designed to operate as a constant current LED driver for up to sixty white LEDs. The LT3598 can drive up to six strings of LEDs, each with up to ten 30mA white LEDs in series, while delivering efficiencies up to 90%. Its multichannel capability makes it ideal for medium sized TFT-LCD backlighting applications, and its input voltage range of 3V to 30V makes it ideal for automotive and industrial applications. The LT3598 offers 1.5% LED current matching to insure uniform brightness of the display.

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Portable Raman Spectroscopy Device

A portable 1064nm Raman Spectroscopy device from Andor Technology (Belfast, Northern Ireland) is based around the Andor iDus InGaAs detector array camera and Bayspec’s high throughput Volume Phase Holographic Gratings (VPHG) spectrograph. The instrument offers price and performance benefits while also featuring thermo-electric detector cooling down to -85°C and USB2.0 plug and play connectivity. The device has an F/1.8 aperture, and spectral resolution of 8cm-1 along with 3000cm-1 spectral coverage.

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Laser Apparatus

Mobius Photonics (Santa Clara, CA) has been awarded U.S. Patent #7,443,903 for a new laser apparatus that has multiple synchronous amplifiers tied to one master oscillator. This fiber-based architecture scales up average power for integration into high throughput machine tools without sacrificing reliability. Conventional diode-pumped, solid-state lasers are incapable of this flexibility and scalability. The laser apparatus is ideal for cost-sensitive applications such as solar cell processing, PCB manufacturing, or display manufacturing.

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Handheld Spectrometer

The i-LAB® Hand Held Analyzing Spectrometer from MicrOptix Technologies (Wilton, ME) performs real-time measurement and analysis of liquids and solids in the visible light range from 400–700nm. Features include a variety of sample interface adapters for sample measurement in the laboratory, field, plant, and classroom environments. The10mm disposable SamplettesTM enable rapid and reliable liquid sample measurement. The spectrometer is able to store data for later uploading to a computer. The i-LAB is powered by three AA batteries and LEDs provide the primary light source.

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Damage-Resistant Mirrors

Saint-Gobain Crystals (Hiram, OH) has introduced high reflectors optimized for use with q-switched, solid-state lasers (Nd:YAG, NdYVO4, and Nd:YLF) operating in the near infrared and visible spectrum (1064nm, 1053nm, 532nm). The coatings on the beam delivery optics are designed to withstand high peak fluences and deliver over 99.5 percent reflectivity. The standard versions of these high-power, solid-state laser reflectors are supplied on 1 inch (25.4mm) or 2-inch (50.8mm) diameter fused silica substrates. They have a specified flatness of λ/10 (at 633nm) and a laser grade surface quality of 10-5 (over an 85 percent clear aperture).

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Dispersion Control Modules

OFS (Norcross, GA) has announced new additions to its FemtoCompTM Modules line of dispersion control technologies for ultra-short pulse lasers. The modules address the difficult-to-match, third- and fourth-order dispersions of commonly used grating compressors. There are four new FemtoComp Modules in addition to the original 1μm wavelength version: two pulse-stretcher modules for either the 1 or 1.55μm wavelength range, a polarization-maintaining module in the 1μm wavelength range, and a module for the .8μm wavelength range.

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Gold Series Panel PCs

Maple Systems, Everett, WA, has released three Gold Series panel PCs in contoured 10", 15", and 17" fanless models. All models feature Intel processors and are preloaded with Windows XP Pro. The fully functional PCs run most Windows-compatible industrial software applications, and are designed for tightly sealed environments where there is no available airflow. The touchscreen interfaces feature high-resolution, high-brightness TFTs that support 16.7 million (24-bit) colors. The fanless models come equipped with a 1.0-GHz Intel Celeron M ULV CPU, and employ a high-speed Ethernet port, two USB ports, and two serial ports on the 10" model, and four serial ports on the 15 and 17" models. Solidstate hard drives are available. With a 40-GB hard drive and 256 MB of flash memory, each model is expandable with numerous options such as 512-MB and 1-GB memory expansions, CD and DVD additions (including CD-ROM, CD-R/W, DVD-ROM, and DVD-R/W), and an 80-GB hard drive upgrade. All models are made with an anodized aluminum bezel, an electrogalvanized steel chassis, and a motherboard designed for harsh manufacturing environments. Applications include remote data entry, remote monitoring, and applications that require support for multiple devices.

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3D Stacked IC Technology (Esc Booth # 1535)

IMEC (Leuven, Belgium) has announced significant progress with its 3D-SIC (3D stacked IC) technology. IMEC recently demonstrated the first functional 3D integrated circuits obtained by die-to-die stacking using 5μm Cu through-silicon vias (TSV). The 3D stacked integrated circuits will be further developed on 200mm and 300mm wafers, integrating test circuits from participating partners. The dies were realized on 200mm wafers in IMEC's reference 0.13μm CMOS process with an added Cu-TSVs process. For stacking, the top die was thinned down to 25μm and bonded to the landing die by Cu-Cu thermocompression.

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