Briefs: Energy
Briefs: Transportation
Articles: Photonics/Optics
Briefs: Aerospace
NASA Langley Research Center has developed a double-sided Si(Ge)/ Sapphire/III-Nitride hybrid structure. This technology uses both sides of a sapphire wafer to build device...
Briefs: Electronics & Computers
Visualizing Motion of Water Molecules for Liquid-Based Electronics
A high-resolution inelastic x-ray scattering technique was used to measure the strong bond involving a hydrogen atom sandwiched between two oxygen atoms. This hydrogen bond is a quantum-mechanical phenomenon responsible for various properties of water, including viscosity, that...
Briefs: Materials
Silicon is a naturally occurring material commonly used as a semiconductor in electronic devices; however, researchers have exhausted the potential of devices with semiconductors made...
Technology Leaders: Electronics & Computers
Photovoltaic systems are continually evolving to improve their efficiency and financial viability. One trend is to move to larger strings of cells giving higher dc voltages to be...
Briefs: Sensors/Data Acquisition
A material was developed for nuclear radiation detection that could provide a significantly less expensive alternative to the detectors now in commercial use. Specifically, the high-performance material is...
Briefs: Communications
Demands for improved computer processing power have led researchers to explore both new processes and other materials beyond silicon to produce electronic components....
Briefs: Automotive
Power electronics used for routing, control, and conversion of electrical power traditionally utilize silicon semiconductors. These systems tend to be bulky, require active cooling, and are inadequate for...
Briefs: Electronics & Computers
High-voltage wide bandgap (WBG) semiconductor devices like 15-kV silicon carbide (SiC) MOSFETs have attracted attention because of potential applications in high-voltage and high-frequency power...
Briefs: Electronics & Computers
Integrated Three-Dimensional Module Heat Exchanger for Power Electronics Cooling
Critical elements in the operation of electric drive systems are power electronics and power semiconductor packages. Improving thermal management of power electronics can help reduce the cost, weight, and volume of electric drive systems, and thus increase market...
Facility Focus: Research Lab
Opened in 1947 on the former site of the U.S. military's Camp Upton in New York, Brookhaven National Lab's (BNL) initial mission centered on the peaceful exploration of the atom. Particle accelerators, leading...
Briefs: Test & Measurement
Before a new high-power semiconductor device can be used for industrial applications, it must be thoroughly tested to determine if it will survive environmental stresses and continue to meet...
Briefs: Electronics & Computers
Researchers at NASA’s Glenn Research Center have developed a revolutionary new generation of silicon...
Briefs: Software
Mesh Adaptation Module for Cartesian Meshes with Embedded Boundaries
This work extends the mesh generation capability of NASA’s Cart3D flow simulation software package to permit cell-by-cell mesh enrichment. Cart3D allows users to perform automated Computational Fluid Dynamics (CFD) analysis on a complex geometry. It includes utilities for...
Briefs: Electronics & Computers
Advanced, Ultra-Low-Loss, High-Frequency Package Module
As electronic circuits approach submillimeter wavelength frequencies (300 GHz) and higher, the traditional low-loss method of packaging electronic circuits in waveguide modules for guiding the signal requires more attention. The reasons are that circuits at higher frequencies have lower...
Briefs: Manufacturing & Prototyping
Ohmic Contact to N- and P-Type Silicon Carbide
Electrical ohmic contacts can be simultaneously formed on silicon carbide (SiC) semiconductors having donor and acceptor impurities (n- and p-type doping, respectively). This implies that such contacts can be formed on SiC layers in one process step during the fabrication of the semiconductor...
Briefs: Electronics & Computers
Dual-Leadframe Transient Liquid Phase Bonded Power Semiconductor Module Assembly and Bonding Process
A high-temperature-capable widebandgap semiconductor power module package, coupled with a new high-temperature- capable bonding process...
Articles: Imaging
Thermal imagers allow a user to see an object’s heat signature, and heat provides an entirely different set of performance data than the visible spectrum available to the...
Briefs: Electronics & Computers
Impedance Discontinuity Reduction Between High-Speed Differential Connectors and PCB Interfaces
High-speed serial communication (i.e., Gigabit Ethernet) requires differential transmission and controlled impedances. Impedance control is essential throughout cabling, connector, and circuit board construction.
Application Briefs: Photonics/Optics
Increasing power densities and decreasing transistor dimensions are hallmarks of many of today’s semiconductor devices, including high-voltage power transistors, laser diodes, and RF power amplifiers....
Articles: Semiconductors & ICs
Part 1 of this article, which appeared in the August 2013 issue of NASA Tech Briefs, dealt with ON-state characterization of high power semiconductors (link to...
Articles: Motion Control
The proliferation of electronic control and electronic power conversion into a variety of industries (e.g., energy generation, industrial motor drives and control,...
Articles: Lighting
A successful LED system design must be able to transfer the active device’s heat efficiently from its own PN junction to the ambient. This path includes the printed circuit board on...
Briefs: Information Technology
Verilog-A Device Models for Cryogenic Temperature Operation of Bulk Silicon CMOS Devices
Verilog-A based cryogenic bulk CMOS (complementary metal oxide semiconductor) compact models are built for state-of-the-art silicon CMOS processes. These models accurately predict device operation at cryogenic temperatures down to 4 K. The models are...
Briefs: Lighting
Nanowires — microscopic fibers that can be “grown” in a lab — have a variety of potential applications, including LEDs and sensors. A team of MIT researchers...
Articles: Lighting Technology
LED, semiconductor, and package designers use complex thermal analysis software to analyze their products, but the analysis is only as good as the data provided. Reliable clarification of heat data upstream and downstream...
Briefs: Photonics/Optics
Spaceflight system electronic devices must survive a wide range of radiation environments with various particle types including energetic protons, electrons,...
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What Really Changed: A Look at the Updated FDA Guidance Document...
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Electrifying Off-Highway Drivetrains
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NVH Prediction in Electric Powertrains: Considering Inverter and...
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Here's an Idea: Powerful Sensors for the Eye
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The Smaller the Part, the Bigger the Advantages of Miniature Aluminum Extrusions
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Here's an Idea: How AI is Changing Military Aircraft Maintenance and More