Keyword: Silicon alloys

Briefs: Data Acquisition

Spintronic devices promise to solve major problems in today's computers, which use massive amounts of electricity to generate heat. This requires expending even more energy for cooling. By contrast, spintronic...

Briefs: Materials
Ceramics Made From Wood

The term “ecoceramics” (a contraction of “environment-conscious ceramics”) denotes a class of ceramics made partly from wood-based products, which can include natural wood, sawdust, cardboard, and/ or paper. In addition to the environmental advantage of renewability of the carbonaceous ingredients, the concept of...

Briefs: Materials

A technique for holding sensor lead wires in place on substrates made of SiC-based monolithic ceramic or SiC/SiC fiber-reinforced ceramic-matrix composite materials involves...

Briefs: Materials
Reactive-Ion Etching of Smooth Vertical Walls in Silicon

An advanced technique of deep reactive-ion etching (DRIE) has been developed for fabricating smooth vertical walls in silicon wafers. These walls are suitable for use as bounding surfaces of optical waveguides in photonic and optoelectronic devices. The roughness of a typical 8-µm-high...

Briefs: Materials
Reaction-Forming Method for Joining SiC-Based Parts

Two reports present additional details about the method described in "Reaction-Forming Method for Joining SiC-Based Ceramic Parts" (LEW-16661), NASA Tech Briefs, Vol. 23, No. 3 (March 1999), page 50. To recapitulate: A carbonaceous mixture (typically a paste) is applied to a joint between...

Briefs: Motion Control

The figure depicts a proposed miniature, electrically actuated, one-time-opening isolation valve that would be made mostly of silicon, by use of micromachining techniques. Isolation...

Briefs: Materials

A process that involves reaction bonding makes it possible to form strong joints, with tailorable thicknesses and compositions, between high-temperature-resistant structural parts...

Briefs: Photonics/Optics
Computer Code for Analysis of Stress in Silicon Wafers

The MacWafer™ code computes gravitational and thermal stresses in silicon wafers and uses these results to determine the maximum allowable temperature variation across a wafer, maximum processing temperatures, and maximum allowable heating and cooling rates. This information is of...

Briefs: Materials

A process that involves reaction forming has been devised to enable the joining of high-temperature-resistant structural parts made of SiC-based materials. These materials...

Briefs: Electronics & Computers
Fabrication of Arrays of Large Step-Free Regions on Si(100)

When a silicon wafer is cut from an ingot, it is essentially impossible to align the cut perfectly with the crystal structure. Therefore the surface contour of the wafer will be a flat plane on which terraces consisting of additional atomic layers will be scattered. An atomic step will...