A process for making superior diffusion platinum-aluminide bond coats for plasma-sprayed or physical-vapor-deposited thermal-barrier coats (TBCs) on superalloy substrates has been devised. The novel aspect of the process lies in the use of several relatively inexpensive pack diffusion steps to...

A process for precleaning brass and copper parts before processing them further in a clean room includes a brightening chemical treatment in solution of 85 volume percent phosphoric acid, 3 volume percent nitric acid, and 12 volume percent acetic acid. This solution acts rapidly and can be discarded...

The MacWafer™ code computes gravitational and thermal stresses in silicon wafers and uses these results to determine the maximum allowable temperature variation across a wafer, maximum processing temperatures, and maximum allowable heating and cooling rates. This information is of particular...

When a silicon wafer is cut from an ingot, it is essentially impossible to align the cut perfectly with the crystal structure. Therefore the surface contour of the wafer will be a flat plane on which terraces consisting of additional atomic layers will be scattered. An atomic step will be...

A report describes research on selected compounds as additives to perfluoroalkyether (PFPAE) fluids that are used as synthetic lubricants for metal parts. Additives are needed to inhibit both thermo-oxidative degradation of, and corrosion of metals by, the PFPAE fluids in the presence of...