Researchers at the University of California, Santa Barbara, have developed a novel device structure that reduces light absorption inside an LED, enables uniform light emission from the active layer, and reduces light reflections occurring repeatedly inside the LED, thus increasing the overall efficiency.

Force sensing is an essential requirement for dexterous robot manipulation, e.g., for extravehicular robots making vehicle repairs. Although strain gauges have been widely used, a new sensing approach is desirable for applications that require greater robustness,...

A methodology for designing spacecraft trajectories in any gravitational environment within the solar system has been developed. The methodology facilitates modeling and optimization for problems ranging from that of a single spacecraft orbiting a single celestial body to that of a mission...

A paper describes the Thermal Infrared Sensor (TIRS), a QWIP-based instrument intended to supplement the Operational Land Imager (OLI) for the Landsat Data Continuity Mission (LDCM). The TIRS instrument is a far-infrared imager operating in the push-broom mode with two IR channels:...

State-of-the-art integrated circuits (ICs) for microprocessors routinely dissipate power densities on the order of 50 W/cm2. This large power is due to the localized heating of ICs operating at high frequencies and must be managed for future highfrequency microelectronic...

A radiation-hard transponder was developed utilizing submicron/ nanotechnology from IBM. The device consumes low power and has a low fabrication cost. This device utilizes a Plug-and-Play concept, and can be integrated into intra-satellite networks, supporting SpaceWire and Gigabit...

This software is designed to predict large active mirror performance at various stages in the fabrication lifecycle of the mirror. It was developed for 1-meter class powered mirrors for astronomical purposes, but is extensible to other geometries. The package accepts finite...

A next-generation microshutter array, LArge Microshutter Array (LAMA), was developed as a multi-object field selector. LAMA consists of small-scaled microshutter arrays that can be combined to form large-scale microshutter array mosaics. Microshutter actuation is...

Microcellular nanocomposite foams and sandwich structures have been created to have excellent electrical conductivity and radiation-resistant properties using a new method that does not involve or release any toxicity. The nanocomposite structures have...

It is known that the impedance at the center of a patch antenna element is a short circuit, implying that a wire or post can be connected from the patch to the groundplane at this point without impacting radiation performance. In principle, this central post can be used to support...

A fabrication process is reported for prototype emitters of THz radiation, which operate cryogenically, and should provide a fast, stable blackbody source suitable for characterization of THz devices. The fabrication has been demonstrated and, at the time of this...

Absorber-coupled microwave kinetic inductance detector (MKID) arrays were developed for submillimeter and farinfrared astronomy. These sensors comprise arrays of lambda/2 stepped microwave impedance resonators patterned on a 1.5-mm-thick silicon membrane, which is optimized for optical coupling. The...

Electrochemical ultracapacitors (ECs) have been developed using graphitic nanostacks as the electrode material. The advantages of this technology will be the reduction of device size due to superior power densities and relative powers compared to traditional activated carbon electrodes....

A sensitive resistor-based NO microsensor, with a wide detection range and a low detection limit, has been developed. Semiconductor microfabrication techniques were used to create a sensor that has a simple, robust structure with a sensing area of 1.10 × 0.99 mm. A Pt interdigitated...

Bump bonding hybridization techniques use arrays of indium bumps to electrically and mechanically join two chips together. Surface-tension issues limit bump sizes to roughly as wide as they are high. Pitches are limited to 50 microns with bumps only 8–14 microns high on each wafer. A new process...

A fabrication process has been developed for cryogenic in-line filtering for the bias and readout of ultrasensitive cryogenic bolometers for millimeter and submillimeter wavelengths. The design is a microstripline filter that cuts out, or strongly attenuates, frequencies (10–50...

A new microsensor fabrication approach has been demonstrated based upon the use of nanostructures as templates. The fundamental idea is that existing nanostructures, such as carbon nanotubes or biological structures, have a material structure that can be used advantageously in order to...

Carbon nanotubes grown from a surface typically have poor bonding strength at the interface. A process has been developed for adding a metal coat to the surface of carbon nanotubes (CNTs) through a “wicking” process, which could lead to an enhanced bonding strength...