Fabricating Composite-Material Structures Containing SMA Ribbons

An improved method of designing and fabricating laminated composite-material (matrix/fiber) structures containing embedded shape-memory-alloy (SMA) actuators has been devised....

Mounting Flip Chips on Heat-Dissipating, Matched-CTE Boards

“Flip chip on board (FCOB) with high thermal conductivity and tailored coefficient of thermal expansion (CTE)” denotes a developmental concept for relatively inexpensive,...

Micromachined Double Resonator

A double-resonator design has been devised for a cloverleaf-shaped silicon microelectromechanical resonator. The double-resonator design provides for an inner, higher-frequency resonator suspended on an outer,...

Better Packaging for Miniature Immersible Diagnostic Systems

A method of packaging now under development would afford improved protection and functionality for miniature immersible diagnostic systems (MIDS). The method involves covering a...

Electronic Modules With a 3-D Interconnection Scheme

An improved three-dimensional (3-D) scheme for modular packaging and interconnection of electronic circuits has been proposed to overcome deficiencies of an older scheme and to obtain...

Organic/Inorganic Coats for Packaging of Microelectronics

A method for protective packaging of multichip modules and related assemblies of microelectronic circuitry involves coating the assemblies with composite organic/inorganic layers...

High-Power-Density DC-to-DC Power-Converter Modules

Dc-to-dc power-converter modules that operate with input potentials from 60 to 140 V and generate various output potentials up to 15 V are undergoing development. Designed specifically for...

Compact Magnetic-Sensor Units for Detecting Mines

Compact, low-power-consumption magnetic-sensor units called "integrated sensor system" (ISS) units are being developed for detecting buried mines and arsenals without exposing human searchers...

Room-Temperature, Ultraviolet Curing of Polyimides

Polyimides have been used widely in fiber-reinforced composite materials for aerospace components and in thin films for packaging of electronic circuitry. Typically, the synthesis of a...

Packaging Electronic Circuits in Multi-Board Modules

The Multi-Board Module (MBM) scheme has been conceived to provide a cost-effective way to combine digital electronic circuits into dense, lightweight packages, within which high-speed...

First-Generation "Space Cube" Electronic-Circuit Packaging

The term "space cube" denotes a scheme for three-dimensional stacking and interconnection of electronic-circuit modules. [This scheme should not be confused with a related one...

System-Level Integrated Circuits for Phased-Array Antennas

Modules of electronic circuitry that perform the amplitude- and phase-control and the status-monitoring functions for eight-element (2 ×4) subarrays of K-band phased-array antennas...

Improved Packaging of Silica Optical Fibers in Sensor Heads

A process for the fabrication of improved high-temperature fiber-optic sensor heads has been proposed. Fiber-optic sensor heads that can withstand hot, dirty, noisy environments are...

Ultrathin Packaging of Multiple Integrated-Circuit Chips

A process being developed for ultrathin packaging of multiple integrated-circuit chips and associated microelectromechanical components makes it possible to fabricate a minimally...

Active Fiber Optic Microelectromechanical Systems Aligner

As currently practiced, packaging of individual optoelectronic components accounts for 40-50 percent of product cost. The development of higher-volume, lower-cost optoelectronic...